Abstract: Apparatus including a body as an intermediary between a device and a printed circuit board, the body including a contact area defined by a plurality of openings each to accommodate a contact therethrough and an alignment feature adjacent the contact area and protruding from a plane defined by the contact area, wherein a surface of the alignment feature includes a friction-reducing material. A method including contacting an alignment feature of a socket with a friction-reducing material. Apparatus and system including a body as an intermediary between a device and a printed circuit board; a plurality of contacts each disposed through a contact area of the body and oriented to deflect a device in a first direction; and a load plate coupled to the body and configured to apply an actuation force on a device in a different second direction. A method including inserting a device into a socket.

Abstract: An apparatus may include an integrated circuit package comprising a plurality of conductive pads and having a face, and a socket coupled to the integrated circuit package and to the conductive pads, the socket having a footprint. In some aspects, the footprint is smaller than the face.

Abstract: In some embodiments, a socket assembly, electronic assembly and electronic system provide current paths for supplying power and I/O signals to a processor. The socket assembly includes a base having an upper surface and a lower surface with a plurality of contacts extending from the upper surface of the base. Each of the contacts is adjacent to another contact such that each of the contacts is part of a differential pair of contacts. Each of the contacts includes a first side and a second side. One of the contacts in each differential pair of contacts is oriented in one direction while the other contact in each differential pair of contacts is oriented in an opposing direction such that the first side of one of the contacts in each differential pair faces in an opposite direction to the first side of the other contacts in each differential pair.

Abstract: An apparatus may include an integrated circuit package comprising a plurality of conductive pads and having a face, and a socket coupled to the integrated circuit package and to the conductive pads, the socket having a footprint. In some aspects, the footprint is smaller than the face.

Abstract: According to a first embodiment of the invention, a Land Grid Array (LGA) socket includes two sets of spring-loaded contacts, the contacts in the first set having an orientation opposite the contacts in the second set. Each set of contacts is positioned such that the total force and total moment of about the socket center by the wiping of the contacts is near zero. According to a second through fourth embodiment of the invention, a rectangular socket may be formed. According to these embodiments, the contacts are divided into four sets. Each set may have a different orientation, arranged so that the total force and moment are near zero.

Abstract: A low-profile package for housing an optoelectric device is disclosed. The low-profile package includes an insulating base having an upper surface. The optoelectric device is mounted to the upper surface of the insulating base. The low-profile package also includes a metal sealing member having a top wall and a bottom wall. The bottom wall of the metal sealing member is attached to the upper surface of the insulating base. The low-profile package further includes a substantially flat metal cover attached to the top wall of the metal sealing member to thereby hermetically seal the metal cover to the insulating base.

Abstract: A package for housing an optoelectronic device and an integrated circuit is disclosed. The package includes an insulating base having an upper surface. The optoelectronic device and the integrated circuit are mounted to the upper surface of the insulating base. The package also includes a metal sealing member having a top wall and a bottom wall. The bottom wall of the metal sealing member is attached to the upper surface of the insulating base. The package further includes a metal cover having a rim located at a bottom portion thereof. The rim of the metal cover is adapted to attach to the top wall of the metal sealing member to thereby hermetically seal the metal cover to the insulating base.

Abstract: A spring plate may be provided between a bolster plate and a board in order to mount components on the opposite side of the board. In some embodiments, the spring plate may provide additional stack tolerance and forceful bias to hold the stack tightly together.

Abstract: A method of manufacturing an optoelectronic packaging comprises placing a solder preform between a metal cover and an insulating base, applying pressure to the metal cover and the insulating base, and applying a current through multiple conductive vias to heat the solder preform to melt.

Abstract: An embodiment of the present invention is a Land Grid Array (LGA) socket. A first L-shaped area has a first center, a first outer long side, and a first outer short side. The first L-shaped area contains a first set of contacts oriented in a first direction. A second L-shaped area has a second center, a second outer long side, and a second outer short side and is located symmetrically to the first L-shaped area. The second L-shaped area contains a second set of contacts oriented in a second direction opposite to the first direction such that pressing a device on the first and second sets of contacts results in approximately zero force and moment.

Abstract: An optoelectronic package includes an insulating base and an optoelectronic device mounted on the upper surface of the insulating base. A metal layer is attached to the upper surface of the insulating base, and a metal cap is attached to the metal layer to hermetically seal the metal cap to the insulating base. In one embodiment, the metal cap is projection welded to the metal layer.

Abstract: A transponder comprises a first TO having a first insulating base, a photodetector mounted on a first side of the first insulating base, and a metal cap hermetically sealed to the first side of the first insulating base to enclose the photodetector. The transponder also comprises a second TO can having a second insulating base, a light generation device mounted on a first side of the second insulating base, and a metal cap hermetically sealed to the first side of the second insulating base to enclose the light generation device. In one embodiment, the transponder operates at 10 GB/s.

Abstract: According to a first embodiment of the invention, a Land Grid Array (LGA) socket includes two sets of spring-loaded contacts, the contacts in the first set having an orientation opposite the contacts in the second set. Each set of contacts is positioned such that the total force and total moment of about the socket center by the wiping of the contacts is near zero. According to a second through fourth embodiment of the invention, a rectangular socket may be formed. According to these embodiments, the contacts are divided into four sets. Each set may have a different orientation, arranged so that the total force and moment are near zero.

Abstract: A spring plate may be provided between a bolster plate and a board in order to mount components on the opposite side of the board. In some embodiments, the spring plate may provide additional stack tolerance and forceful bias to hold the stack tightly together.

Abstract: A spring plate may be provided between a bolster plate and a board in order to mount components on the opposite side of the board. In some embodiments, the spring plate may provide additional stack tolerance and forceful bias to hold the stack tightly together.

Abstract: A spring plate may be provided between a bolster plate and a board in order to mount components on the opposite side of the board. In some embodiments, the spring plate may provide additional stack tolerance and forceful bias to hold the stack tightly together.

Abstract: An optoelectronic module with integrated cooler is described herein.

Abstract: A package for housing an optoelectronic device and an integrated circuit is disclosed. The package includes an insulating base having an upper surface. The optoelectronic device and the integrated circuit are mounted to the upper surface of the insulating base. The package also includes a metal sealing member having a top wall and a bottom wall. The bottom wall of the metal sealing member is attached to the upper surface of the insulating base. The package further includes a metal cover having a rim located at a bottom portion thereof. The rim of the metal cover is adapted to attach to the top wall of the metal sealing member to thereby hermetically seal the metal cover to the insulating base.

Abstract: A transponder comprises a first TO having a first insulating base, a photodetector mounted on a first side of the first insulating base, and a metal cap hermetically sealed to the first side of the first insulating base to enclose the photodetector. The transponder also comprises a second TO can having a second insulating base, a light generation device mounted on a first side of the second insulating base, and a metal cap hermetically sealed to the first side of the second insulating base to enclose the light generation device. In one embodiment, the transponder operates at 10 GB/s.

Abstract: A method of manufacturing a hermetically-sealed optoelectronic package having an insulating base, a metal cap, and a metal layer sandwiched between the metal cap and the insulating base includes supplying a force to push the metal cap against the metal layer and to push the metal layer against the insulating base. A first electrode is applied to the metal cap, and a second electrode is applied to the metal layer. A current is supplied between the first and second electrodes to weld the metal cap to the metal layer.