Patents by Inventor Tifenn M. Boisard

Tifenn M. Boisard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method of unified cooling solution in an IOT device
    Patent number: 10548248
    Abstract: A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: January 28, 2020
    Assignee: Dell Products, LP
    Inventors: Christopher M. Helberg, Travis C. North, Tifenn M. Boisard, Deeder M. Aurongzeb
  • SYSTEM AND METHOD OF UNIFIED COOLING SOLUTION IN AN IOT DEVICE
    Publication number: 20170231110
    Abstract: A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.
    Type: Application
    Filed: February 10, 2016
    Publication date: August 10, 2017
    Applicant: Dell Products, LP
    Inventors: Christopher M. Helberg, Travis C. North, Tifenn M. Boisard, Deeder M. Aurongzeb
  • All-in-one information handling system stand
    Patent number: D855619
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: August 6, 2019
    Assignee: Dell Products L.P.
    Inventors: Antonio T. Latto, Joseph E. Jasinski, Cheng-Chia Chiu, Tifenn M. Boisard, Daniel A. Phipps
  • All-in-one information handling system stand
    Patent number: D883297
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: May 5, 2020
    Assignee: Dell Products L.P.
    Inventors: Antonio T. Latto, Joseph E. Jasinski, Cheng-Chia Chiu, Tifenn M. Boisard, Daniel A. Phipps