Patents by Inventor Tiffany Nichole Reagan

Tiffany Nichole Reagan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-sensor package and associated method of assembling the same
    Patent number: 9278849
    Abstract: A micro-sensor package is provided that includes a micro-sensor and printed circuit board (PCB), or that includes an array of micro-sensors and PCB. The micro-sensor includes a first substrate having opposing front and back surfaces, a sensing element on the front surface of the first substrate, and a through-chip via disposed within the first substrate and electrically connected to the sensing element. The PCB includes a second substrate to which the back surface of the first substrate is bonded. The second substrate defines a recess within which a bond pad is disposed, and the through-chip via of the micro-sensor is electrically connected to the bond pad of the PCB. The micro-sensor package may further include a shim bonded to the PCB, and that may surround an outer boundary of the micro-sensor and have approximately the same thickness as the micro-sensor.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: March 8, 2016
    Assignees: The Boeing Company, University of Florida Research Foundation, Incorporated
    Inventors: James Robert Underbrink, Mark Sheplak, Dylan Paul Alexander, Tiffany Nichole Reagan, Jessica Caitlin Meloy
  • Micro-Sensor Package And Associated Method Of Assembling The Same
    Publication number: 20130336511
    Abstract: A micro-sensor package is provided that includes a micro-sensor and printed circuit board (PCB), or that includes an array of micro-sensors and PCB. The micro-sensor includes a first substrate having opposing front and back surfaces, a sensing element on the front surface of the first substrate, and a through-chip via disposed within the first substrate and electrically connected to the sensing element. The PCB includes a second substrate to which the back surface of the first substrate is bonded. The second substrate defines a recess within which a bond pad is disposed, and the through-chip via of the micro-sensor is electrically connected to the bond pad of the PCB. The micro-sensor package may further include a shim bonded to the PCB, and that may surround an outer boundary of the micro-sensor and have approximately the same thickness as the micro-sensor.
    Type: Application
    Filed: June 15, 2012
    Publication date: December 19, 2013
    Applicant: The Boeing Company
    Inventors: James Robert Underbrink, Mark Sheplak, Dylan Paul Alexander, Tiffany Nichole Reagan, Jessica Caitlin Meloy