Abstract: Systems and methods for altering the shape of a reconfigurable surface area are presented. The present systems and methods facilitate efficient and effective interaction with a device or system. In one embodiment, a surface reconfiguration system includes a flexible surface; an elevation unit that creates alterations in the contours of the surface; and an elevation control component that controls adjustments to the elevation unit. Thus, the surface of the device is reconfigurable based on system, application, mode, and/or user needs. Accordingly, the surface can be used to provide input and output functionality. The surface can include touch detection functionality for added input functionality.

Abstract: A method and system for differentiating between intended user input and inadvertent or incidental contact with a touchpad is herein disclosed. When a user engages the touchpad, sensors on the touchpad are activated and generate touch sensor signals. Based on the pattern of engaged sensors, a hand pattern can be determined. From the hand pattern, a hand model may be retrieved. The hand model may indicate passive zones and active zones. Contact in the active zones may be considered intentional, while contact in the passive zones may be considered unintended or incidental. Moreover, a global shift may be calculated, and input from the active zones may be compensated for the global shift. The input from the active zones can then be used to control a graphical user interface.

Abstract: A method and system for plating CoNiFe is disclosed. The method and system include providing a plating solution including hydroxymethyl-p-tolylsulfone and plating the CoNiFe film on a substrate in the plating solution. The plating solution is configured to provide a CoNiFe film having a high saturation magnetic flux density and having a composition of 50-70 weight percent of Fe and 3-8 weight percent of Ni. In another aspect, the method and system include plating at least a portion of a first and/or second pole of a write head using the plating solution including hydroxymethyl-p-tolylsulfone and configured to plate the CoNiFe film having a high saturation magnetic flux density and a composition of 50-70 weight percent of Fe and 3-8 weight percent of Ni.