Patents by Inventor Till Neddermann

Till Neddermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230390859
    Abstract: A method of welding includes providing first and second joining partners, providing a welding apparatus that includes a sonotrode comprising a structured working surface, arranging the first and second joining partners to contact one another, and forming a welded connection between the first and second joining partners by contacting the first joining partner with the structured working surface and vibrating the sonotrode at an ultrasonic frequency, wherein the structured working surface comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and wherein for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.
    Type: Application
    Filed: August 18, 2023
    Publication date: December 7, 2023
    Inventors: Till Neddermann, Michal Chajneta, Alparslan Takkac
  • Patent number: 11772187
    Abstract: An ultrasonic welding apparatus includes a sonotrode comprising a structured working surface that comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: October 3, 2023
    Assignee: Infineon Technologies AG
    Inventors: Till Neddermann, Michal Chajneta, Alparslan Takkac
  • Publication number: 20230170286
    Abstract: A terminal element or bus bar for a power semiconductor module arrangement includes a first end configured to be arranged inside a housing of the power semiconductor module arrangement, a second end configured to be arranged outside of the housing of the power semiconductor module arrangement, and at least a first section and a second section arranged successively between the first end and the second end along a length of the terminal element or bus bar, wherein either the first section includes a first material, the second section includes a second material, and the first material differs from the second material, or the first section has a first thickness, the second section has a second thickness, and the first thickness differs from the second thickness, or both.
    Type: Application
    Filed: November 28, 2022
    Publication date: June 1, 2023
    Inventors: Arthur Unrau, Florian Dreps, Christoph Koch, Till Neddermann, Christian Steininger
  • Publication number: 20220347786
    Abstract: An ultrasonic welding apparatus includes a sonotrode comprising a structured working surface that comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.
    Type: Application
    Filed: April 30, 2021
    Publication date: November 3, 2022
    Inventors: Till Neddermann, Michal Chajneta, Alparslan Takkac