Patents by Inventor Tilman Schlenker

Tilman Schlenker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6797661
    Abstract: The dielectric composition contains a mixture of a ceramic composition containing BaaREbTicO3, wherein RE represents a rare earth element, with 0.05≦a≦0.25, 0.525≦b≦0.70, 0.85≦c≦1.0, and 2a+3b+4c=6, and free from lead and bismuth, a glass composition, and a metal oxide. The glass composition preferably contains ZnO or MgO, SiO2, and at least 10% by weight of Li2O or TiO2. Preferably, the alkaline earth metal oxide is MgO. By preference, the glass composition essentially consists of 50-80% weight of SiO2, 5-25% weight of MgO, and optionally another alkaline earth metal oxide, and 10-25% by weight of Li2O, and is substantially free from boron. The dielectric composition can be sintered in the presence of Cu electrodes at a temperature below the melting point of Cu so as to manufacture an electronic device such as a ceramic multilayer element. After sintering, the dielectric composition has a relative dielectric constant of at least 55.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: September 28, 2004
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Ronald Mikkenie, Gerardus Christiaan Marie Dortant, Knuth Albertsen, Heinz Georg Kohler, Tilman Schlenker
  • Patent number: 6721164
    Abstract: The invention describes an electronic component, in particular a multiplayer component, with a dielectric and at least one electrode. The dielectric is a composite made of a dielectric ceramic material and an organic polymer. To manufacture the electronic component, the dielectric ceramic material is mixed with a suitable monomer, the mass id formed, and the monomer is polymerized. Ceramic bodies of stable shape are obtained which can be processed further into capacitors, antennas, or other passive components in that electrodes are provided. Sintering of the electronic components is no longer necessary.
    Type: Grant
    Filed: April 16, 2001
    Date of Patent: April 13, 2004
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Knuth Albertsen, Wilhelm-Albert Groen, Tilman Schlenker
  • Publication number: 20030141783
    Abstract: The invention relates to an array of ultrasound transducers which each comprise a substrate (1), a membrane (2), a first electrode (4), a piezoelectric layer (5), and a second electrode (6), wherein the substrate (1) comprises at least one opening (3) which adjoins the membrane (2) at one side, while the piezoelectric layer (5) has a high piezoelectric coupling coefficient k and is textured. The invention further relates to an ultrasound transducer and to a method of manufacturing an array of ultrasound transducers.
    Type: Application
    Filed: November 27, 2002
    Publication date: July 31, 2003
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
    Inventors: Mareike Klee, Tilman Schlenker, Olaf Dannappel, Hans-Peter Loebl, Georg Schmitz, John Fraser
  • Patent number: 6515402
    Abstract: The invention relates to an array of ultrasound transducers which each comprise a substrate (1), a membrane (2), a first electrode (4), a piezoelectric layer (5), and a second electrode (6), wherein the substrate (1) comprises at least one opening (3) which adjoins the membrane (2) at one side, while the piezoelectric layer (5) has a high piezoelectric coupling coefficient k and is textured. The invention further relates to an ultrasound transducer and to a method of manufacturing an array of ultrasound transducers.
    Type: Grant
    Filed: January 24, 2001
    Date of Patent: February 4, 2003
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Mareike Klee, Tilman Schlenker, Olaf Dannappel, Hans-Peter Loebl, Georg Schmitz, John Fraser
  • Publication number: 20020105250
    Abstract: The invention relates to an array of ultrasound transducers which each comprise a substrate (1), a membrane (2), a first electrode (4), a piezoelectric layer (5), and a second electrode (6), wherein the substrate (1) comprises at least one opening (3) which adjoins the membrane (2) at one side, while the piezoelectric layer (5) has a high piezoelectric coupling coefficient k and is textured. The invention further relates to an ultrasound transducer and to a method of manufacturing an array of ultrasound transducers.
    Type: Application
    Filed: January 24, 2001
    Publication date: August 8, 2002
    Applicant: U.S. PHILIPS CORPORATION
    Inventors: Mareike Klee, Tilman Schlenker, Olaf Dannappel, Hans-Peter Loebl, Georg Schmitz, John Fraser
  • Publication number: 20020093782
    Abstract: The dielectric composition contains a mixture of a ceramic composition containing BaaREbTicO3, wherein RE represents a rare earth element, with 0.05≦a≦0.25, 0.525≦b≦0.70, 0.85≦c≦1.0, and 2a+3b+4c=6, and free from lead and bismuth, a glass composition, and a metal oxide. The glass composition preferably contains ZnO or MgO, SiO2, and at least 10% by weight of Li2O or TiO2. Preferably, the alkaline earth metal oxide is MgO. By preference, the glass composition essentially consists of 50-80% weight of SiO2, 5-25% weight of MgO, and optionally another alkaline earth metal oxide, and 10-25% by weight of Li2O, and is substantially free from boron. The dielectric composition can be sintered in the presence of Cu electrodes at a temperature below the melting point of Cu so as to manufacture an electronic device such as a ceramic multilayer element. After sintering, the dielectric composition has a relative dielectric constant of at least 55.
    Type: Application
    Filed: August 7, 2001
    Publication date: July 18, 2002
    Inventors: Ronald Mikkenie, Gerardus Christiaan Marie Dortant, Knuth Albertsen, Heinz Georg Kohler, Tilman Schlenker
  • Patent number: 6323824
    Abstract: A dielectric resonator antenna has a dielectric layer and a conducting layer formed on a main surface of the dielectric layer. An electrical contact is formed on the main surface for connecting the dielectric layer to a transmission line for transferring a signal between the dielectric layer and the transmission line. The electrical contact is insulated from the conducting layer. A conducting strip is connected to the electrical contact and is on a side surface of the dielectric layer. The side surface is not on the same plane of the main surface. Rather, the side surface is perpendicular to the main surface of the dielectric layer.
    Type: Grant
    Filed: August 6, 1999
    Date of Patent: November 27, 2001
    Assignee: U.S. Philips Corporation
    Inventors: Frank Heinrichs, Tilman Schlenker