Patents by Inventor Tilo Liebl

Tilo Liebl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for contacting a contact surface on a flexible circuit with a metal contact, crimping part, connection of flexible circuit and metal contact and control device
    Patent number: 10886644
    Abstract: The disclosure relates to a method for contacting a contact surface on a flexible circuit board with a metal contact outside the flexible circuit board, with the aid of a press-fit pin. An attachment piece having a sleeve for receiving the press-fit pin is a mechanically and electrically coupled to the flexible circuit board.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: January 5, 2021
    Assignee: Vitesco Technologies Germany GmbH
    Inventors: Nikolaus Taschner, Tilo Liebl
  • Method For Contacting A Contact Surface On A Flexible Circuit With A Metal Contact, Crimping Part, Connection Of Flexible Circuit And Metal Contact And Control Device
    Publication number: 20190296464
    Abstract: The disclosure relates to a method for contacting a contact surface on a flexible circuit board with a metal contact outside the flexible circuit board, with the aid of a press-fit pin. An attachment piece having a sleeve for receiving the press-fit pin is a mechanically and electrically coupled to the flexible circuit board.
    Type: Application
    Filed: June 10, 2019
    Publication date: September 26, 2019
    Applicant: CPT Zwei GmbH
    Inventors: Nikolaus Taschner, Tilo Liebl
  • Flexible printed board
    Patent number: 8853547
    Abstract: A flexible printed circuit board, in particular for the spatial connection of electronic components, includes a carrier foil (1), several bonding surfaces (10) arranged on a solder side (4) of the carrier foil (1), and several soldering surfaces (2) arranged on a bonding side (12) of the carrier foil (1) opposite the solder side. The soldering surfaces (2) are connected to the bonding surfaces (10) via electrical strip conductors, and a stiffening plate (3) is inseparably connected to the carrier foil (1) on the solder side thereof.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: October 7, 2014
    Assignees: Conti Temic microelectronic GmbH, Carl Freudenberg KG
    Inventors: Andreas Voegerl, Tilo Liebl, Gerhard Bauer, Marion Gebhardt, Alexander Wenk, Matthias Wieczorek, Juergen Henniger, Karl-Heinz Baumann
  • Protective cover for a flexible printed circuit board
    Patent number: 8785783
    Abstract: A protective cover for mounting a flexible printed circuit board in a protected manner, includes a protective unit for covering a surface of the flexible printed circuit board and a connecting unit for securely connecting a reinforcing plate to the protective cover.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: July 22, 2014
    Assignees: Conti Temic microelectronic GmbH, Carl Freudenberg KG, Swoboda KG
    Inventors: Klaus Scharrer, Tilo Liebl, Matthias Wieczorek, Alexander Wenk, Juergen Henniger, Karl-Heinz Baumann, Barbara Haering
  • Protective Cover For A Flexible Printed Circuit Board
    Publication number: 20120067622
    Abstract: The invention relates to a protective cover (1) for mounting a flexible printed circuit board (14) in a protected manner, with a protective unit (2) for covering a surface (21) of the flexible printed circuit board (14) and a connecting unit (3) for securely connecting a reinforcing plate (19) of the flexible printed circuit board (14) to the protective cover (1).
    Type: Application
    Filed: October 9, 2009
    Publication date: March 22, 2012
    Applicants: Conti Temic microelectronic GmbH, Swoboda KG, Carl Freudenberg KG
    Inventors: Klaus Scharrer, Tilo Liebl, Matthias Wieczorek, Alexander Wenk, Hans-Juergen Haering, Barbara Haering, Juergen Henniger, Karl-Heinz Baumann
  • Flexible Printed Board
    Publication number: 20110232946
    Abstract: Flexible printed board, in particular for the spatial connection of electronic components, comprising a carrier foil (1), several bonding surfaces (10) arranged on the carrier foil (1), several soldering surfaces (2) arranged on the carrier foil (1), which soldering surfaces (2) are connected to the bonding surfaces (10) via electrical strip conductors, and a stiffening plate (3) that is inseparably connected to the carrier foil (1), wherein the soldering surfaces (2) and the stiffening plate (3) are arranged on a solder side (4) of the carrier foil (1) and the bonding surfaces (10) are arranged on a bonding side (12) that is arranged opposite the solder side (4).
    Type: Application
    Filed: October 9, 2009
    Publication date: September 29, 2011
    Inventors: Andreas Voegerl, Tilo Liebl, Gerhard Bauer, Marion Gebhardt, Alexander Wenk, Matthias Wieczorek, Juergen Henniger, Karl-Heinz Baumann
  • Arrangement for electrical and/or mechanical components on a large, flexible foil type conductor area
    Patent number: 8004850
    Abstract: The present system and method relate to an arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area and a method for producing such an arrangement. The flexible foil-type conductor can be easily and flexibly handled and is inexpensive and process-reliable.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: August 23, 2011
    Assignee: Conti Temic Microelectronic GmbH
    Inventors: Turhan Büyükbas, Matthias Gramann, Klaus Scharrer, Peter Guth, Joachim Buhl, Dominik Klein, Bernhard Schuch, Tilo Liebl
  • Arrangement for electrical and/or mechanical components on a large, flexible foil type conductor area
    Publication number: 20060268529
    Abstract: The present system and method relate to an arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area and a method for producing such an arrangement. The flexible foil-type conductor can be easily and flexibly handled and is inexpensive and process-reliable.
    Type: Application
    Filed: April 2, 2004
    Publication date: November 30, 2006
    Applicant: Continental Teves AG & Co. oHG
    Inventors: Turhan Büyükbas, Matthias Gramann, Klaus Scharrer, Peter Guth, Joachim Buhl, Dominik Klein, Bernhard Schuch, Tilo Liebl