Patents by Inventor Tilo Welker

Tilo Welker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230286872
    Abstract: The invention relates to a process for producing a metal-ceramic substrate (1), comprising: —providing a ceramic element (10), a metal ply (40) and at least one metal layer (30), —forming an ensemble (18) of the ceramic element (10), the metal ply (40) and the at least one metal layer (30), —forming a gas-tight container (30) surrounding the ceramic element (10), wherein the at least one metal layer (30) is arranged between the ceramic element (10) and the metal ply (40) in the container, and—forming the metal-ceramic substrate (1) by hot isostatic pressing.
    Type: Application
    Filed: July 30, 2021
    Publication date: September 14, 2023
    Inventors: Fabian WAGLE, Stefan BRITTING, Tilo WELKER
  • Publication number: 20230171887
    Abstract: A support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer (10) and—an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq.
    Type: Application
    Filed: April 28, 2021
    Publication date: June 1, 2023
    Inventors: Tilo Welker, Karsten Schmidt, Stefan Britting
  • Publication number: 20230094926
    Abstract: An electronics module (100), especially a power electronics module, comprising a metal-ceramic substrate (1) serving as a carrier and having a ceramic element (10) and a primary component metallization (21), an insulation layer (40) directly or indirectly connected to the primary component metallization (21), and a secondary component metallization (22) which is connected to the side of the insulation layer (40) facing away from the metal-ceramic substrate (1) and is especially isolated from the primary component metallization (21) using the insulation layer (40), wherein the ceramic element (10) has a first size (L1, D1) and the insulation layer (40) has a second size (L2, D2) and a ratio of the second size (L2, D2) to the first size (L1, D1) has a value smaller than 0.8, to form an island-like insulation layer (40) on the primary component metallization (21).
    Type: Application
    Filed: March 8, 2021
    Publication date: March 30, 2023
    Inventors: Andreas Meyer, Karsten Schmidt, Tilo Welker
  • Publication number: 20230031736
    Abstract: A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising: a base material and an active metal, wherein the solder material (30) is a foil comprising the base material in a first layer (31) and the active metal in a second layer (32), and wherein the foil has a total thickness (GD) which is less than 50 ?m, preferably less than 25 ?m and particularly preferably less than 15 ?m.
    Type: Application
    Filed: December 3, 2020
    Publication date: February 2, 2023
    Inventors: Stefan Britting, Tilo Welker, Karsten Schmidt