Abstract: Systems and methods for material singulation. According to some embodiments, methods for material singulation may include applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material in such a way that surfaces created by the singulation of the material are substantially free from defects.

Abstract: Systems and methods for processing, selectively ablating, and singulating layered materials. According to some embodiments, methods for selectively ablating a layered material may include selectively varying a wavelength of at least a portion of a primary ultrafast laser beam to create a secondary ultrafast laser beam with a second wavelength, the primary ultrafast laser beam being configured to ablate a layer of the layered material, the secondary ultrafast laser beam being configured to ablate an additional layer of the layered material and applying the first and second ultrafast laser beams to the layered material to create a singulated product.

Abstract: Systems and methods for laser based processing of layered materials. Methods may include selectively adjusting ultrafast laser output of an ultrafast laser device based upon one or more physical attributes of a layer of the layered material, applying the ultrafast laser output of the ultrafast laser device to the layer of the layered material along a tool path to ablate the layer along the tool path, and then re-executing the steps to ablate one or more additional layers, the re-execution occurring for each distinct layer of the layered material that is to be ablated.

Abstract: An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.

Abstract: The method of and device for cutting brittle materials with tailored edge shape and roughness are disclosed. The methods can include directing one or more tools to a portion of brittle material causing separation of the material into two or more portions, where the as-cut edge has a predetermined and controllable geometric shape and/or surface morphology. The one or more tools can comprise energy (e.g., a femtosecond laser beam or acoustic beam) delivered to the material without making a physical contact.

Abstract: Systems and methods for material singulation. According to some embodiments, methods for material singulation may include applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material in such a way that surfaces created by the singulation of the material are substantially free from defects.

Abstract: Systems and methods for laser based processing of layered materials. Methods may include selectively adjusting ultrafast laser output of an ultrafast laser device based upon one or more physical attributes of a layer of the layered material, applying the ultrafast laser output of the ultrafast laser device to the layer of the layered material along a tool path to ablate the layer along the tool path, and then re-executing the steps to ablate one or more additional layers, the re-execution occurring for each distinct layer of the layered material that is to be ablated.

Abstract: Systems and methods for processing, selectively ablating, and singulating layered materials. According to some embodiments, methods for selectively ablating a layered material may include selectively varying a wavelength of at least a portion of a primary ultrafast laser beam to create a secondary ultrafast laser beam with a second wavelength, the primary ultrafast laser beam being configured to ablate a layer of the layered material, the secondary ultrafast laser beam being configured to ablate an additional layer of the layered material and applying the first and second ultrafast laser beams to the layered material to create a singulated product.

Abstract: An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.

Abstract: Systems and methods for transforming biological materials utilizing ultrafast laser light. According to some embodiments, a method for transforming a biological material may include calculating an ablation profile for the biological material by comparing initial characteristics of the biological material to desired characteristics for the biological material, and applying an output of an ultrafast laser to the biological material to transform the biological material using the ablation profile in such a way that collateral damage to remaining biological material is reduced.