Patents by Inventor Tim BORETIUS

Tim BORETIUS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260095010
    Abstract: An installation tool set for producing an implantable medical device includes an installation tool with a rod longitudinal axis and an axially extending rod surface, along which a local recess is introduced. A fixing body defines a through channel, through which the installation tool is passable along a first rod section and into which an opening opens. The opening is oriented orthogonally to the through channel, around which an internal thread is arranged within the fixing body. An adjusting rod has a joining contour that is counter-contoured relative to the local recess in the installation tool and a counter-thread engageable with the internal thread of the fixing body. A receiving structure defines a recess into which the installation tool is inserted. The fixing body, an electrically conductive contact ring, and an electrically insulating, elastically deformable seal ring are arranged coaxially and in axially serial sequence along the installation tool.
    Type: Application
    Filed: September 6, 2023
    Publication date: April 2, 2026
    Inventors: Fabian Kimmig, Tim Boretius, Daniel Kempter
  • Publication number: 20260083974
    Abstract: An implantable electrical contact arrangement has at least one electrode element arrangement enclosed entirely by biocompatible, electrically insulating material, and an electrode surface that is directly or indirectly enclosed by the biocompatible, electrically insulating material, the electrode element arrangement having a stack-shaped layer composite which has a metallization layer at least on a ceramic substrate over an adhesion promoter layer. The layer composite is bonded to a passivation layer such that covalent bonds are formed, and is otherwise completely encased by the passivation layer, except for at least one surface area of a metallization layer facing away from the layer composite. The passivation layer has a surface facing away from the layer composite and to which the biocompatible, electrically insulating material is directly or indirectly adjacent.
    Type: Application
    Filed: September 4, 2023
    Publication date: March 26, 2026
    Inventors: Tim Boretius, Patrick Kiele
  • Publication number: 20260083961
    Abstract: A medical implant forms a sleeve for arranging about a nerve fiber bundle. The sleeve has a film-like substrate with a first section that converts into a hollow-cylindrical shape. A first end of the first section rests against a first surface of the first section in the wound state. The first surface faces an area enclosed by the wound first section. A second end lies opposite the first end and in the wound state is arranged laterally to a second surface of the first section. The second surface faces away from the first surface and from the radially enclosed area. An area of the first section end is monolithically connected with a second section, which in the wound state is adjacent to the second surface of the first section. The first and second sections have the set shape, with a winding direction oriented oppositely relative to the first end.
    Type: Application
    Filed: September 4, 2023
    Publication date: March 26, 2026
    Inventors: Fabian Kimmig, Tim Boretius, Max Eickenscheidt
  • Patent number: 12485289
    Abstract: A medical handling which connects two implants arranged spatially separated from each other, by a flexible connecting line, along which a mechanical interface forms a plug-socket connection. The handling set comprises a tube and a mandrin which is internally guided therein and provides a mandrin tip, fixedly attached to a distal mandrin region which is a releasable first joint. In the joined state the handling set projects beyond the distal tube end. A first joining contour, which is part of a second joint, as well as an adapter element with a counter joining contour which is contoured counter to the first joint forms a second join, and a second joining contour contoured counter to the plug or socket of the mechanical interface which is part of a third joint.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: December 2, 2025
    Assignee: NEUROLOOP GMBH
    Inventors: Daniel Kempter, Fabian Kimmig, Tim Boretius
  • Patent number: 12403320
    Abstract: The invention is a head part of an implantable device, method of production thereof and a plug which can be fitted into the head part. The head part comprises a housing which has at least one blind hole plug contact socket with a socket opening as well as a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable sealing ring, which are enclosed by a solidified casting compound, are joined together coaxially axially. Arranged within the head part is at least one second blind hole plug contact socket with a socket opening as a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable sealing ring is located, which are enclosed by the solidified casting compound, are joined together in a coaxial arrangement and in an axially serial sequence.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: September 2, 2025
    Assignee: Neuroloop GmbH
    Inventors: Fabian Kimmig, Tim Boretius
  • Patent number: 12324911
    Abstract: An implantable electrical contact arrangement comprising at least one electrode element entirely integrated into a carrier substrate of a biocompatible, electrically insulating material, and at least one freely accessible electrode surface enclosed by the biocompatible, electrically insulating carrier substrate. Within at least one space of the carrier substrate, which does not contain an electrode element, the carrier substrate surrounds at least one space containing at least one material with a modulus of elasticity differing from a modulus of elasticity of the material of the carrier substrate.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: June 10, 2025
    Assignee: NEUROLOOP GMBH
    Inventors: Fabian Kimmig, Tim Boretius
  • Patent number: 12278452
    Abstract: The invention pertains to a head part of an implantable device, its method of production and a plug assembly which can be fitted into the head part. The head part comprises a head part housing which has at least one blind hole plug contact socket with a socket opening and a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable seal ring is positioned and which are enclosed by a solidified casting compound, are joined together in a coaxial arrangement and in an axially serial sequence.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: April 15, 2025
    Assignee: NEUROLOOP GMBH
    Inventors: Fabian Kimmig, Tim Boretius
  • Patent number: 12109423
    Abstract: A method for the production of a medical implant, comprising a head section, which has at least one blind hole-type recess of an electrical plug-in contact socket, along which is arranged at least one electrically conductive contact element, together with a supply section, which is fixedly connected to the head section, and which comprises at least one electrical component, which is one of at least one microcontroller, and an electrical energy source, which are electrically connected to the at least one electrically conductive contact by way of at least one electrical conductor.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: October 8, 2024
    Assignee: Neuroloop GmbH
    Inventors: Fabian Kimmig, Tim Boretius, Florian Adami
  • Patent number: 11813061
    Abstract: The invention relates to an implantable electric multi-pole connection between an electric implant and an electric feed and discharge structure. The invention is characterised in that a flexible, film-like, electrically non-conductive, strip-shaped surface element is arranged between the implant and the feed and discharge structure. The surface element comprises at least one first surface, on which a number of electrodes n greater than of equal to two is arranged, which are respectively connected to the electric implant by means of electric connection conductors extending at least in parts inside the surface element. The electric feed and discharge structure comprises at least n lines which are electrically insulated from each other and which are electrically connected to one of the n electrodes.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: November 14, 2023
    Assignee: NEUROLOOP GMBH
    Inventors: Fabian Kimmig, Tim Boretius, Dennis Plachta
  • Patent number: 11815543
    Abstract: The invention is an assembly for checking the functionality of a measuring object, that is a DUT, in a medical implant or at least one part of the medical implant. The assembly comprises a test signal generator, a test module that is connected to the test signal generator. The assembly has a first receiving structure with at least one contact electrode, into which an adapter rigidly connects to the DUT in a releasable manner which is inserted to form least one electrical contact. A control and analysis unit is connected to the test signal generator and to the test module in a wired or wireless manner.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: November 14, 2023
    Assignee: NEUROLOOP GMBH
    Inventors: Fabian Kimmig, Tim Boretius, Daniel Kempter, Janosch Dobler, Christian Goslich
  • Publication number: 20230293894
    Abstract: Described is a medical handling set for connecting two implants, which are arranged spatially separated from each other, by means a flexible connecting line, along which a mechanical interface in the form of a plug-socket connection is provided. The handling set comprises a tube and a mandrin which is internally guided therein and provides a mandrin tip, which is fixedly attached to the distal mandrin region in a releasable manner by means of a first joint and in the joined state projects beyond the distal tube end, a first joining contour, which is part of a second joint, as well as an adapter element with a counter joining contour which is contoured counter to the first joint for forming the second joint, and with a second joining contour which is contoured counter to the plug or socket part of the mechanical interface and is part of a third joint.
    Type: Application
    Filed: June 9, 2021
    Publication date: September 21, 2023
    Inventors: Daniel KEMPTER, Fabian KIMMIG, Tim BORETIUS
  • Patent number: 11712558
    Abstract: The invention is a medical implant which is a wrap-around cuff comprising a flexible, biocompatible, film carrier substrate, that has a carrier substrate region which is wrapped around a wrap axis to form a tube. The invention has a protective structure directly or indirectly attached to the carrier substrate, which can be transformed from a first, open state into a second closed state that encloses the carrier substrate region that is wrapped to form a tube at least axially around a wrapping axis extending in the peripheral direction of the tube.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: August 1, 2023
    Assignee: NEUROLOOP GMBH
    Inventors: Dennis Plachta, Fabian Kimmig, Tim Boretius
  • Publication number: 20230211166
    Abstract: The invention is a head part of an implantable device, method of production thereof and a plug which can be fitted into the head part. The head part comprises a housing which has at least one blind hole plug contact socket with a socket opening as well as a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable sealing ring, which are enclosed by a solidified casting compound, are joined together coaxially axially. Arranged within the head part is at least one second blind hole plug contact socket with a socket opening as a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable sealing ring is located, which are enclosed by the solidified casting compound, are joined together in a coaxial arrangement and in an axially serial sequence.
    Type: Application
    Filed: May 4, 2021
    Publication date: July 6, 2023
    Inventors: Fabian KIMMIG, Tim BORETIUS
  • Patent number: 11691004
    Abstract: A device for the extravasal or extraneuronal fastening of a medical implant has a biocompatible surface substrate including a first substrate portion which is a compression sleeve and a free end portion. By winding the first substrate portion about a spatial axis, the axis is loosely radially covered in at least one layer by the wound first substrate portion. A second substrate portion, which is attached integrally to the first substrate portion which is not wound about the spatial axis, has a connection extending away from the medical implant.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: July 4, 2023
    Assignee: NEUROLOOP GMBH
    Inventors: Dennis Plachta, Tim Boretius, Fabian Kimmig, Christina Hassler
  • Publication number: 20230106271
    Abstract: The invention pertains to a head part of an implantable device, its method of production and a plug assembly which can be fitted into the head part. The head part comprises a head part housing which has at least one blind hole plug contact socket with a socket opening and a socket base axially opposite the socket opening, along which at least one electrically conductive contact ring element and an electrically insulating, elastically deformable seal ring is positioned and which are enclosed by a solidified casting compound, are joined together in a coaxial arrangement and in an axially serial sequence.
    Type: Application
    Filed: April 9, 2021
    Publication date: April 6, 2023
    Inventors: Fabian KIMMIG, Tim BORETIUS
  • Patent number: 11541230
    Abstract: The invention is an implantable electrical connection between an electrical implant which has at least one electrical conductor and at least one electrical feed line. The invention further relates to a method for producing an implantable electrical connection between an electrical implant. The invention comprises at least one electrical cable having a cable end, to which an electrically conductive flat piece is unsupportedly fined, and that the at least one implant-side electrical conductor is joined to the flat piece.
    Type: Grant
    Filed: May 28, 2018
    Date of Patent: January 3, 2023
    Assignee: NEUROLOOP GMBH
    Inventors: Dennis Plachta, Fabian Kimmig, Tim Boretius
  • Publication number: 20220341988
    Abstract: The invention is an assembly for checking the functionality of a measuring object, that is a DUT, in a medical implant or at least one part of the medical implant. The assembly comprises a test signal generator, a test module that is connected to the test signal generator. The assembly has a first receiving structure with at least one contact electrode, into which an adapter rigidly connects to the DUT in a releasable manner which is inserted to form least one electrical contact. A control and analysis unit is connected to the test signal generator and to the test module in a wired or wireless manner.
    Type: Application
    Filed: October 1, 2020
    Publication date: October 27, 2022
    Inventors: Fabian KIMMIG, Tim BORETIUS, Daniel KEMPTER, Janosch DOBLER, Christian GOSLICH
  • Patent number: 11478635
    Abstract: The invention has a contact assembly including a spatial longitudinal extension which is orientated parallel to the winding axis. The contact assembly is fixedly joined to the carrier substrate along a joining region which has a joining region length orientated in parallel to the winding axis. The orthogonal projection relative to the winding axis overlaps with a first region of the carrier substrate which is wound into a tube.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: October 25, 2022
    Assignee: NEUROLOOP GMBH
    Inventors: Tim Boretius, Dennis Plachta, Fabian Kimmig
  • Patent number: 11471690
    Abstract: A method for producing a head part of an implantable medical device is described, with a head part housing, which has a recess in the form of a blind hole, along which at least one electrically conducting contact ring element, together with an electrically insulating, elastically deformable sealing ring, are joined together in a force fit in a coaxial arrangement and an axial serial sequence under an axial joining force. The method is characterized in that the generation of the joining force between the at least one contact ring element and the sealing ring is executed along the assembly tool by use of means of attachment fitted on both sides of the at least one contact ring element and the sealing ring along the assembly tool, of which at least one means of attachment is axially movably and detachably fixed in an axially secure manner to the assembly tool.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: October 18, 2022
    Assignee: NEUROLOOP GMBH
    Inventors: Fabian Kimmig, Tim Boretius
  • Publication number: 20220212000
    Abstract: An implantable electrical contact arrangement comprising at least one electrode element entirely integrated into a carrier substrate of a biocompatible, electrically insulating material, and at least one freely accessible electrode surface enclosed by the biocompatible, electrically insulating carrier substrate. Within a sub-space which does not contain an electrode element, the carrier substrate surrounds at least one space containing at least one material with a modulus of elasticity differing from a modulus of elasticity of the material of the carrier substrate.
    Type: Application
    Filed: April 30, 2020
    Publication date: July 7, 2022
    Inventors: Fabian KIMMIG, Tim BORETIUS