Patents by Inventor Tim Butler

Tim Butler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11965762
    Abstract: We disclose herein a flow sensor comprising: a first substrate comprising an etched portion, a dielectric region located on a first side of the first substrate, wherein the dielectric region comprises at least one dielectric membrane located over the etched portion of the first substrate, a sensing element located on or within the dielectric membrane, and a second substrate adjoining a second side of the first substrate. The first side of the first substrate and the second side of the first substrate are opposite sides. The first substrate and the second substrate cooperate to form a sensing channel through the flow sensor.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: April 23, 2024
    Assignee: Flusso Limited
    Inventors: Syed Zeeshan Ali, Andrea De Luca, Cerdin Lee, Tim Butler, Ethan Gardner, Florin Udrea
  • Patent number: 11280649
    Abstract: We disclose herein a flow sensor assembly comprising a first substrate, a flow sensor located over the first substrate, a lid located over the flow sensor, a flow inlet channel, and a flow outlet channel. A surface of the flow sensor and a surface of the lid cooperate to form a flow sensing channel between the flow inlet channel and the flow outlet channel, and a surface of the flow sensing channel is substantially flat throughout the length of the flow sensing channel.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: March 22, 2022
    Assignee: FLUSSO LIMITED
    Inventors: Andrea De Luca, Cerdin Lee, Tim Butler, Ethan Gardner, Florin Udrea
  • Publication number: 20210116280
    Abstract: We disclose herein a flow sensor comprising: a first substrate comprising an etched portion, a dielectric region located on a first side of the first substrate, wherein the dielectric region comprises at least one dielectric membrane located over the etched portion of the first substrate, a sensing element located on or within the dielectric membrane, and a second substrate adjoining a second side of the first substrate. The first side of the first substrate and the second side of the first substrate are opposite sides. The first substrate and the second substrate cooperate to form a sensing channel through the flow sensor.
    Type: Application
    Filed: October 21, 2019
    Publication date: April 22, 2021
    Inventors: Syed Zeeshan Ali, Andrea De Luca, Cerdin Lee, Tim Butler, Ethan Gardner, Florin Udrea
  • Publication number: 20210116278
    Abstract: We disclose herein a flow sensor assembly comprising a first substrate, a flow sensor located over the first substrate, a lid located over the flow sensor, a flow inlet channel, and a flow outlet channel. A surface of the flow sensor and a surface of the lid cooperate to form a flow sensing channel between the flow inlet channel and the flow outlet channel, and a surface of the flow sensing channel is substantially flat throughout the length of the flow sensing channel.
    Type: Application
    Filed: October 21, 2019
    Publication date: April 22, 2021
    Inventors: Andrea De Luca, Cerdin Lee, Tim Butler, Ethan Gardner, Florin Udrea
  • Patent number: 10760312
    Abstract: A hinge assembly is provided. The hinge assembly includes a first hinge component and a second hinge component. The first hinge component includes a leaf portion terminating in a first knuckle and a second knuckle. The first knuckle includes a protrusion and the second knuckle includes a recess. The second hinge component is rotatably coupled to the first hinge component and is structurally identical to the first hinge component. The protrusion of the first hinge component is configured to fit within the recess of the second hinge component, and the protrusion of the second hinge component is configured to fit within the recess of the first hinge component.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: September 1, 2020
    Assignee: Johnson Controls Technology Company
    Inventors: Tim Butler, Victor E. Dodge, Aaron Jerabek, Kirk Henderson, Tai P. Luc, Dave P. DeBoer, Philip L. Bushong, Troy Wert, Debra L. Weich
  • Publication number: 20190226756
    Abstract: A refrigeration control unit configured to modify an operating condition of a refrigeration unit is provided. The refrigeration control unit includes a first device housing component and a second device housing component defining a main refrigeration control device. The refrigeration control unit further includes a user interface component. The user interface component includes multiple controls configured to permit selection of multiple refrigeration unit operating parameters and a display. The user interface component is configured to be detachably coupled to the main refrigeration control device such that the user interface component is operational both when mounted in the main refrigeration control device and when mounted at a location remote to the main refrigeration control device.
    Type: Application
    Filed: January 18, 2019
    Publication date: July 25, 2019
    Applicant: Johnson Controls Technology Company
    Inventors: Dave P. DeBoer, Tai P. Luc, Timothy J. Riesch, Kirk P. Henderson, Tim Butler, Krishna Danturti
  • Publication number: 20180216380
    Abstract: A hinge assembly is provided. The hinge assembly includes a first hinge component and a second hinge component. The first hinge component includes a leaf portion terminating in a first knuckle and a second knuckle. The first knuckle includes a protrusion and the second knuckle includes a recess. The second hinge component is rotatably coupled to the first hinge component and is structurally identical to the first hinge component. The protrusion of the first hinge component is configured to fit within the recess of the second hinge component, and the protrusion of the second hinge component is configured to fit within the recess of the first hinge component.
    Type: Application
    Filed: October 6, 2017
    Publication date: August 2, 2018
    Inventors: Tim Butler, Victor E. Dodge, Aaron Jerabek, Kirk Henderson, Tai P. Luc, Dave P. DeBoer, Philip L. Bushong, Troy Wert, Debra L. Weich
  • Patent number: D837666
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: January 8, 2019
    Assignee: Johnson Controls Technology Company
    Inventors: Tim Butler, Phil Bushong, Dave DeBoer, Kirk Henderson, Roy Rader, Debra Weich