Abstract: A method for fabricating semiconductor components includes the steps of providing a semiconductor substrate having a circuit side, a back side and integrated circuits and circuitry on the circuit side; thinning the substrate from the back side to a selected thickness to form a thinned substrate; applying a dopant to the back side of the thinned substrate; and laser processing the back side of the thinned substrate to form a plurality of patterns of lasered features containing the dopant. The dopant can be selected to modify properties of the semiconductor substrate such as carrier properties, gettering properties, mechanical properties or visual properties.

Abstract: A method for fabricating semiconductor components includes the steps of providing a semiconductor substrate having a circuit side, a back side and integrated circuits and circuitry on the circuit side; thinning the substrate from the back side to a selected thickness to form a thinned substrate; applying a dopant to the back side of the thinned substrate; and laser processing the back side of the thinned substrate to form a plurality of patterns of lasered features containing the dopant. The dopant can be selected to modify properties of the semiconductor substrate such as carrier properties, gettering properties, mechanical properties or visual properties.

Abstract: A semiconductor component includes a thinned semiconductor substrate having a back side and a circuit side containing integrated circuits and associated circuitry. The semiconductor component also includes at least one lasered feature on the back side configured to provide selected electrical or physical characteristics for the substrate. The lasered feature can cover the entire back side or only selected areas of the back side, and can be configured to change electrical properties, mechanical properties or gettering properties of the substrate.

Abstract: Methods and systems for improving resource utilization when remoting three dimensional graphics commands that are generated by an application executing on a local computing machine. An agent that executes on a local computing machine intercepts a first call to a drawing library. The application generates this first call to request information from the drawing library. The agent further transmits a first frame that is generated by the application, to a remote computing machine, and prevents a return of the first call to the requesting application until the agent receives a notification indicating either the first frame was transmitted to the remote computing device or the first frame was rendered. Upon receiving such a notification, the agent permits the return of the first call to the requesting application.

Abstract: A semiconductor component includes a thinned semiconductor substrate having a back side and a circuit side containing integrated circuits and associated circuitry. The semiconductor component also includes at least one lasered feature on the back side configured to provide selected electrical or physical characteristics for the substrate. The lasered feature can cover the entire back side or only selected areas of the back side, and can be configured to change electrical properties, mechanical properties or gettering properties of the substrate.

Abstract: Methods and systems for providing three dimensional graphics to remote computing machines and appliances that include an agent executing on a local computing machine to intercept a plurality of graphics commands generated by a three dimensional application executing on a local computing machine. A first portion of the plurality of graphics commands are encoded by the agent using a first codec, while a second portion of the plurality of graphics commands are encoded by the agent using a second codec. The agent creates a frame comprising the first portion and the second portion of the plurality of graphics commands, compresses the frame, and transmits the frame to a remote computing machine.

Abstract: A method for fabricating semiconductor components includes the steps of providing a semiconductor substrate having a circuit side, a back side and integrated circuits and circuitry on the circuit side; thinning the substrate from the back side to a selected thickness; laser processing the back side of the thinned substrate to form at least one lasered feature on the back side; and dicing the substrate into a plurality of components having the lasered feature. The lasered feature can cover the entire back side or only selected areas of the back side, and can be configured to change electrical properties, mechanical properties or gettering properties of the substrate. A semiconductor component includes a thinned semiconductor substrate having a back side and a circuit side containing integrated circuits and associated circuitry. The semiconductor component also includes at least one lasered feature on the back side configured to provide selected electrical or physical characteristics for the substrate.

Abstract: Methods and systems for providing three dimensional graphics to remote computing machines and appliances that include an agent executing on a local computing machine to intercept a plurality of graphics commands generated by a three dimensional application executing on a local computing machine. A first portion of the plurality of graphics commands are encoded by the agent using a first codec, while a second portion of the plurality of graphics commands are encoded by the agent using a second codec. The agent creates a frame comprising the first portion and the second portion of the plurality of graphics commands, compresses the frame, and transmits the frame to a remote computing machine.

Abstract: A system including at least one system microphone, a processor connected to computer readable memory and the at least one system microphone, a measurement microphone connected to the processor, at least one audio speaker, a signal generator connected to the processor and configured to produce signals from the at least one audio speaker for both the measurement microphone and the at least one system microphone to measure the response of the at least one audio speaker, and a device manager application executable from the computer readable memory and configured to perform the steps of calibrating the at least one audio speaker with the measurement microphone using the signals of the signal generator based on the response of the at least one audio speaker thereby creating at least one calibrated audio speaker and calibrating the at least one system microphone with the at least one calibrated audio speaker using the signals of the signal generator.

Abstract: A method for fabricating semiconductor components includes the steps of providing a semiconductor substrate having a circuit side, a back side and integrated circuits and circuitry on the circuit side; thinning the substrate from the back side to a selected thickness; laser processing the back side of the thinned substrate to form at least one lasered feature on the back side; and dicing the substrate into a plurality of components having the lasered feature. The lasered feature can cover the entire back side or only selected areas of the back side, and can be configured to change electrical properties, mechanical properties or gettering properties of the substrate. A semiconductor component includes a thinned semiconductor substrate having a back side and a circuit side containing integrated circuits and associated circuitry. The semiconductor component also includes at least one lasered feature on the back side configured to provide selected electrical or physical characteristics for the substrate.

Abstract: A system including at least one system microphone, a processor connected to computer readable memory and the at least one system microphone, a measurement microphone connected to the processor, at least one audio speaker, a signal generator connected to the processor and configured to produce signals from the at least one audio speaker for both the measurement microphone and the at least one system microphone to measure the response of the at least one audio speaker, and a device manager application executable from the computer readable memory and configured to perform the steps of calibrating the at least one audio speaker with the measurement microphone using the signals of the signal generator based on the response of the at least one audio speaker thereby creating at least one calibrated audio speaker and calibrating the at least one system microphone with the at least one calibrated audio speaker using the signals of the signal generator.

Abstract: Methods and systems for rendering three dimensional graphical data by intercepting a three dimensional graphics stream comprising three dimensional graphics commands generated by an application executing on a first computing machine, and then analyzing the characteristics associated with a remoting system to determine a location for rendering three dimensional data from the three dimensional graphics commands. The remoting system may comprise at least the first computing machine having a graphics rendering component, a second computing machine having a graphics rendering component and a network. Based on the analysis, a rendering location is determined and the application is induced to reinitialize a context for determining where to render three dimensional data. The three dimensional data is then rendered from the three dimensional graphics commands at the rendering location.

Abstract: Methods and systems for improving resource utilization when remoting three dimensional graphics commands that are generated by an application executing on a local computing machine. An agent that executes on a local computing machine intercepts a first call to a drawing library. The application generates this first call to request information from the drawing library. The agent further transmits a first frame that is generated by the application, to a remote computing machine, and prevents a return of the first call to the requesting application until the agent receives a notification indicating either the first frame was transmitted to the remote computing device or the first frame was rendered. Upon receiving such a notification, the agent permits the return of the first call to the requesting application.

Abstract: Methods and system for computing a hash from a three dimensional data set loaded into a three dimensional resource, these methods and systems first determining that an application, executing in a distributed computing environment, locked a three dimensional resource. A identification of a first three dimensional data set loaded into the three dimensional resource by the application is then made. The first three dimensional data set can have a size that is determined in part by a transaction carried out by the application. The performance of an operation on the three dimensional resource by the application is then detected, a first hash is computed on the loaded first set of three dimensional data using a hash function, and the first hash is stored in a repository. Prior to computing the first hash, a portion of the first three dimensional data set can be eliminated, where the portion of the three dimensional data set results from a repetitious transaction.

Abstract: Methods and systems for detecting a dirty region within a frame encompassing three dimensional graphics and three dimensional graphics primitives. The methods and systems include executing an application on a local computing machine, the application generating three dimensional graphics, and issuing at least one function call. An agent also executes on the local computing machine to intercept the issued function call; identify, in response to intercepting the function call, at least one location within a frame that contains three dimensional graphics commands generated by the application, where the identified location corresponding to a drawing region; determine a change in a portion of the three dimensional graphics commands associated with the identified location; and extract the changed portion. The agent may also identify a plurality of locations and a plurality of changed three dimensional graphics commands at those locations.

Abstract: Methods and systems for providing three dimensional graphics to remote computing machines and appliances that include an agent executing on a local computing machine to intercept a plurality of graphics commands generated by a three dimensional application executing on a local computing machine. A first portion of the plurality of graphics commands are encoded by the agent using a first codec, while a second portion of the plurality of graphics commands are encoded by the agent using a second codec. The agent creates a frame comprising the first portion and the second portion of the plurality of graphics commands, compresses the frame, and transmits the frame to a remote computing machine.

Abstract: A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

Abstract: A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

Abstract: A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

Abstract: A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After bum-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.