Patents by Inventor Tim E. Murphy

Tim E. Murphy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS
    Publication number: 20080153204
    Abstract: An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes one or more vias having conductive material formed therein and which extend from an active surface to a back surface of the semiconductor substrate. The redistribution lines are patterned on the back surface of the semiconductor substrate, extending from the conductive material in the vias to predetermined locations on the back surface of the semiconductor substrate that correspond with an interconnect pattern of another substrate for interconnection thereto.
    Type: Application
    Filed: January 2, 2008
    Publication date: June 26, 2008
    Applicant: Micron Technology, Inc.
    Inventors: Timothy L. Jackson, Tim E. Murphy
  • Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods
    Patent number: 7355273
    Abstract: An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes one or more vias having conductive material formed therein and which extend from an active surface to a back surface of the semiconductor substrate. The redistribution lines are patterned on the back surface of the semiconductor substrate, extending from the conductive material in the vias to predetermined locations on the back surface of the semiconductor substrate that correspond with an interconnect pattern of another substrate for interconnection thereto.
    Type: Grant
    Filed: April 20, 2005
    Date of Patent: April 8, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Timothy L. Jackson, Tim E. Murphy
  • Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof
    Patent number: 6962867
    Abstract: An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes one or more vias having conductive material formed therein and which extend from an active surface to a back surface of the semiconductor substrate. The redistribution lines are patterned on the back surface of the semiconductor substrate, extending from the conductive material in the vias to predetermined locations on the back surface of the semiconductor substrate that correspond with an interconnect pattern of another substrate for interconnection thereto.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: November 8, 2005
    Assignee: MicronTechnology, Inc.
    Inventors: Timothy L. Jackson, Tim E. Murphy
  • Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies
    Patent number: 6800930
    Abstract: An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes one or more vias having conductive material formed therein and witch extend from an active surface to a back surface of the semiconductor substrate. The redistrobution patterns are patterned on the back surface of the semiconductor substrate, extending from the conductive material in the vias to predetermined locations on the back surface of the semiconductor substrate that correspond with an interconnect pattern of another substrate for interconnection thereto.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: October 5, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Timothy L. Jackson, Tim E. Murphy
  • Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods of fabrication and assemblies
    Publication number: 20040121521
    Abstract: An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes one or more vias having conductive material formed therein and which extend from an active surface to a back surface of the semiconductor substrate. The redistribution lines are patterned on the back surface of the semiconductor substrate, extending from the conductive material in the vias to predetermined locations on the back surface of the semiconductor substrate that correspond with an interconnect pattern of another substrate for interconnection thereto.
    Type: Application
    Filed: December 10, 2003
    Publication date: June 24, 2004
    Inventors: Timothy L. Jackson, Tim E. Murphy
  • SEMICONDUCTOR DICE HAVING BACKSIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS OF FABRICATION AND ASSEMBLIES
    Publication number: 20040021139
    Abstract: An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes one or more vias having conductive material formed therein and which extend from an active surface to a back surface of the semiconductor substrate. The redistribution lines are patterned on the back surface of the semiconductor substrate, extending from the conductive material in the vias to predetermined locations on the back surface of the semiconductor substrate that correspond with an interconnect pattern of another substrate for interconnection thereto.
    Type: Application
    Filed: July 31, 2002
    Publication date: February 5, 2004
    Inventors: Timothy L. Jackson, Tim E. Murphy