Abstract: Aspects of the present disclosure relate to a pick-and-place apparatus that is configured to cause components to be placed on a substrate in a number of passes, and during each pass, components among a plurality of components are placed on the substrate in a respective placement pattern among a collection of interleaved placement patterns.

Abstract: The disclosure relates to a method for transferring electrical components from a source substrate to empty positions on a target substrate. Further aspects relate to an apparatus for carrying out this method and to a corresponding computer program product. According to an aspect of the disclosure a binning map is constructed of the source substrate by assigning each electrical component to a respective bin among M bins based on one or more parameters of the electrical components. The target substrate is divided into unit cells, and each unit cell includes component positions, each component position being associated with a respective bin. The electrical components are arranged on the target substrate so that, at each component position of each unit cell, an electrical component from the source substrate is arranged that is assigned to the same bin as the bin that is associated with that component position.

Abstract: A carrier positioning device for positioning a carrier, and a pick-and-place device including the same is provided. The disclosure relates to a method for positioning a carrier, and to a method for arranging an electrical component on a carrier. The carrier includes a first and a second surface, the first surface includes a first central region on which electrical components are arranged, and a first edge region adjacent to the first central region. According to an aspect of the present disclosure, the carrier is flattened on a flattening side of a flattening member. The flattening member with the carrier on the flattening side is moved so that the carrier is pressed with its first surface against a flat abutment side of an abutment member. The abutment member is configured to leave an opening exposing the first central region when the carrier is in abutment with the flat abutment side.

Abstract: Aspects of the present disclosure relate to a pick-and-place apparatus that is configured to cause components to be placed on a substrate in a number of passes, and during each pass, components among a plurality of components are placed on the substrate in a respective placement pattern among a collection of interleaved placement patterns.

Abstract: Aspects of the present disclosure relate to a pick-and-place apparatus that is configured to cause components to be placed on a substrate in a number of passes, and during each pass, components among a plurality of components are placed on the substrate in a respective placement pattern among a collection of interleaved placement patterns.