Abstract: A connecting terminal includes a bottom plate having a plurality of bumps and/or a plurality of recesses arranged on a surface of the bottom plate, a first arm extending from a first end of the first arm to a second end of the first arm, and a second arm extending from a first end of the second arm to a second end of the second arm. The first end of the first arm and the first end of the second arm are respectively coupled to a pair of sides of the bottom plate, and the first arm, the bottom plate, and the second arm form a space for accommodating a wire. The bumps and/or the recesses scrape an insulated layer of a wire and form an electrical connection with the wire.

Abstract: A conductive terminal includes a first pair of clamping arms forming a first clamping portion for connecting with a wire, and a second pair of clamping arms connected to the first pair of clamping arms by a connecting part. The first clamping portion has a first clamping sub-portion and a second clamping sub-portion distributed along a length direction. The second pair of clamping arms forms a second clamping portion. The second clamping portion has a third clamping sub-portion and a fourth clamping sub-portion distributed along the length direction. The first clamping sub-portion corresponds to the third clamping sub-portion in the length direction. A width of the first clamping sub-portion is greater than a width of the third clamping sub-portion. The second clamping sub-portion corresponds to the fourth clamping sub-portion in the length direction. A width of the second clamping sub-portion is less than a width of the fourth clamping sub-portion.

Abstract: An electrical connector comprises a housing and a terminal position assurance. The housing includes a cavity extending along a cavity axis, with one side of the cavity having a positioning hole, and a pair of sides. The terminal position assurance has a top wall having a positioning column extending downward therefrom and aligned with the positioning hole, and two side walls extending downward from the top wall. The side walls selectively engage with the pair of sides of the housing in a first locking position and a second locking position. The first and second locking positions are defined along an actuation axis perpendicular to the cavity axis. In the first locking position, the positioning column is held out of the cavity. In the second locking position, the positioning column is moved into the cavity and is adapted to engage with a terminal arranged within the cavity.

Abstract: The disclosure herein relates to rechargeable batteries and solid electrolytes therefore which include lithium-stuffed garnet oxides, for example, in a thin film, pellet, or monolith format wherein the density of defects at a surface or surfaces of the solid electrolyte is less than the density of defects in the bulk. In certain disclosed embodiments, the solid-state anolyte, electrolyte, and catholyte thin films, separators, and monoliths consist essentially of an oxide that conducts Li+ ions. In some examples, the disclosure herein presents new and useful solid electrolytes for solid-state or partially solid-state batteries. In some examples, the disclosure presents new lithium-stuffed garnet solid electrolytes and rechargeable batteries which include these electrolytes as separators between a cathode and a lithium metal anode.

Abstract: A semiconductor device package includes a semiconductor die including bond pads and an underfill inlet side, a substrate including a first metal layer and lower metal layers underneath the first metal layer, a plurality of metal contacts and trace segment lines disposed in the first metal layer, and a plurality of solder bump rows. Each of the solder bump rows is oriented substantially parallel to the inlet side of the semiconductor die and electrically connects bond pads of the semiconductor die with corresponding metal contacts in the first metal layer of the substrate. Each of the trace segment lines is oriented substantially parallel to the inlet side of the semiconductor die, is electrically coupled to a respective solder bump row of the plurality of solder bump rows, and includes trace segments disposed in the first metal layer and trace segments disposed in one or more of the lower metal layers.

Abstract: A semiconductor device includes a first semiconductor die having a top planar surface and a second semiconductor die having a bottom planar surface and a top planar surface. A protective layer including a bottom planar surface and a top planar surface is positioned between the first semiconductor die and the second semiconductor die. An adhesive layer having a top planar surface and a bottom planar surface is between the protective layer and the second semiconductor die. A periphery of the top planar surface of the first semiconductor die is covered by a periphery of the bottom planar surface of the protective layer after cutting a portion of the protective layer that extended past the periphery of the surface of the first semiconductor die. The protective layer reduces the occurrence of peeling of the second semiconductor die and first semiconductor die coupled to the protective layer.

Abstract: Described herein are compositions and methods for predicting drug responsiveness in cellular samples from cancer subjects. Described herein are compositions and methods that can help determine treatment options and select subjects for clinical trials.

Abstract: The present invention provides an integrated lighting apparatus including a main frame constructed by at least a first frame wall, a second frame wall adjacent to the first frame wall and a third frame wall adjacent to the second frame wall and opposite to the first frame wall. The first, second and third frame walls define an interior space for receiving a lighting device therein. The main frame is integrated with a heat-dissipating portion extending from a first side of the first frame wall. The interior space is covered with the lampshade. Through the heat-dissipating portion, the lighting apparatus is detachably combined with the refrigerated display cabinet in a simple and convenient manner.

Abstract: The present invention provides an integrated lighting apparatus including a main frame constructed by at least a first frame wall, a second frame wall adjacent to the first frame wall and a third frame wall adjacent to the second frame wall and opposite to the first frame wall. The first, second and third frame walls define an interior space for receiving a lighting device therein. The main frame is integrated with a heat-dissipating portion extending from a first side of the first frame wall. The interior space is covered with the lampshade. Through the heat-dissipating portion, the lighting apparatus is detachably combined with the refrigerated display cabinet in a simple and convenient manner.