Patents by Inventor Tim J. Bales

Tim J. Bales has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MOS linear region impedance curvature correction
    Patent number: 7579862
    Abstract: A system and method to correct or cancel MOS linear region impedance curvature employing an analog solution to trim out the MOS linear region impedance curvature while accommodating PVT spreads in values of internal or external precision resistors. The linear region curvature correction may be obtained by using two MOS transistors in the pad driver/buffer and operating the transistors so as to proportionately increase output impedance of one of them when the output impedance of the other decreases, and vice versa. A linear pad impedance may be maintained over a range of Vpad values, while also maintaining the Vgs supplied to pad driver transistors at its maximum possible value to obtain greater linearity.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: August 25, 2009
    Assignee: Micron Technology, Inc.
    Inventor: Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Patent number: 7432593
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: October 7, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Sion C. Quinlan, Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Patent number: 7414299
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: August 19, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Sion C. Quinlan, Tim J. Bales
  • MOS linear region impedance curvature correction
    Patent number: 7403033
    Abstract: A system and method to correct or cancel MOS linear region impedance curvature employing an analog solution to trim out the MOS linear region impedance curvature while accommodating PVT spreads in values of internal or external precision resistors. The linear region curvature correction may be obtained by using two MOS transistors in the pad driver/buffer and operating the transistors so as to proportionately increase output impedance of one of them when the output impedance of the other decreases, and vice versa. A linear pad impedance may be maintained over a range of Vpad values, while also maintaining the Vgs supplied to pad driver transistors at its maximum possible value to obtain greater linearity.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: July 22, 2008
    Assignee: Micron Technology, Inc.
    Inventor: Tim J. Bales
  • MOS linear region impedance curvature correction
    Patent number: 7282948
    Abstract: A system and method to correct or cancel MOS linear region impedance curvature employing an analog solution to trim out the MOS linear region impedance curvature while accommodating PVT spreads in values of internal or external precision resistors. The linear region curvature correction may be obtained by using two MOS transistors in the pad driver/buffer and operating the transistors so as to proportionately increase output impedance of one of them when the output impedance of the other decreases, and vice versa. A linear pad impedance may be maintained over a range of Vpad values, while also maintaining the Vgs supplied to pad driver transistors at its maximum possible value to obtain greater linearity.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: October 16, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Patent number: 7256068
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: August 14, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Sion C. Quinlan, Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Patent number: 7221040
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: May 22, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Sion C. Quinlan, Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Patent number: 7176566
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: February 13, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Sion C. Quinlan, Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Patent number: 7166918
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: January 23, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Sion C. Quinlan, Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Patent number: 7091584
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Grant
    Filed: February 7, 2005
    Date of Patent: August 15, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Sion C. Quinlan, Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Patent number: 6922341
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Grant
    Filed: July 30, 2003
    Date of Patent: July 26, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Sion C. Quinlan, Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Patent number: 6851183
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: February 8, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Sion C. Quinlan, Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Publication number: 20040070951
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Application
    Filed: July 30, 2003
    Publication date: April 15, 2004
    Inventors: Sion C. Quinlan, Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Publication number: 20040061208
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Application
    Filed: September 30, 2003
    Publication date: April 1, 2004
    Inventors: Sion C. Quinlan, Tim J. Bales
  • Semiconductor package assembly and method for electrically isolating modules
    Publication number: 20030087473
    Abstract: A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
    Type: Application
    Filed: January 25, 2002
    Publication date: May 8, 2003
    Inventors: Sion C. Quinlan, Tim J. Bales