Patents by Inventor Tim LI

Tim LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250225344
    Abstract: A method is provided, in which infrastructure configuration parameters received from a configuration management database are converted into an infrastructure-as-code configuration language file. Infrastructure configuration modifications are applied to the infrastructure-as-code configuration language file. The modified infrastructure-as-code configuration language file is forwarded to an infrastructure-as-a-service provider. Provisional infrastructure-as-code parameters output by the infrastructure-as-a-service provider in response to the modified infrastructure-as-code configuration language file are converted to updated infrastructure configuration parameters. The updated infrastructure configuration parameters are transmitted for storage in the configuration management database.
    Type: Application
    Filed: December 31, 2024
    Publication date: July 10, 2025
    Applicant: Tencent America LLC
    Inventors: Tim LI, Yuhao QIU, Shiwei LIU
  • Publication number: 20250168219
    Abstract: A method includes receiving, by a user interface layer in a client terminal, application code input by a user, processing the input application code by a client-as-a-service layer in the client terminal, and forwarding the input application code to be stored in a cloud-based repository. The method further includes synchronizing application code stored in a cache with application code stored in the cloud-based repository, and performing a runtime remodel on a runtime system based on the input application code.
    Type: Application
    Filed: March 22, 2024
    Publication date: May 22, 2025
    Applicant: Tencent America LLC
    Inventors: Tim LI, Yuhao QIU, Shiwei LIU
  • Publication number: 20250157740
    Abstract: An improved capacitor is provided. The capacitor is of the wound-type category and surface-mountable to provide high capacities in a compact form factor.
    Type: Application
    Filed: February 16, 2023
    Publication date: May 15, 2025
    Applicant: TDK Electronics AG
    Inventors: Tim LI, William LIANG, Royal QIU, Hongzhi WANG, David OLALLA MARTINEZ, Eduardo DREHMER