Patents by Inventor Tim M. Gates

Tim M. Gates has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having multi-signal bus bars
    Patent number: 7034390
    Abstract: A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die side coupled to the IC. A plurality of multi-signal bus bars is coupled to a socket side of the substrate such that the bus bars enable I/O signals to be transported between the substrate and a socket.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: April 25, 2006
    Assignee: Intel Corporation
    Inventors: Tim M. Gates, Brent S. Stone
  • Semiconductor package having multi-signal bus bars
    Patent number: 6724077
    Abstract: A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die side coupled to the IC. A plurality of multi-signal bus bars is coupled to a socket side of the substrate such that the bus bars enable I/O signals to be transported between the substrate and a socket.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: April 20, 2004
    Assignee: Intel Corporation
    Inventors: Tim M. Gates, Brent S. Stone
  • Semiconductor package having multi-signal bus bars
    Publication number: 20040061215
    Abstract: A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die side coupled to the IC. A plurality of multi-signal bus bars is coupled to a socket side of the substrate such that the bus bars enable I/O signals to be transported between the substrate and a socket.
    Type: Application
    Filed: September 26, 2003
    Publication date: April 1, 2004
    Inventors: Tim M. Gates, Brent S. Stone
  • Semiconductor package having multi-signal bus bars
    Publication number: 20030089970
    Abstract: A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die side coupled to the IC. A plurality of multi-signal bus bars is coupled to a socket side of the substrate such that the bus bars enable I/O signals to be transported between the substrate and a socket.
    Type: Application
    Filed: November 9, 2001
    Publication date: May 15, 2003
    Inventors: Tim M. Gates, Brent S. Stone