Patents by Inventor Tim M. Spencer

Tim M. Spencer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for enhanced cooling
    Patent number: 11291106
    Abstract: An electronic device includes a packaged device and a thermal dissipater. The packaged device includes a component that generates thermal energy, a package that encapsulates the component, and an interconnect that forms a portion of a high thermal conduction between the component and a circuit card. The thermal dissipater obtains the thermal energy using the circuit card and radiates the thermal energy.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: March 29, 2022
    Assignee: Dell Products L.P.
    Inventors: Isaac Q. Wang, Jordan H. Chin, James L. Petivan, Robert Boyd Curtis, Tim M. Spencer
  • SYSTEM AND METHOD FOR ENHANCED COOLING
    Publication number: 20210235575
    Abstract: An electronic device includes a packaged device and a thermal dissipater. The packaged device includes a component that generates thermal energy, a package that encapsulates the component, and an interconnect that forms a portion of a high thermal conduction between the component and a circuit card. The thermal dissipater obtains the thermal energy using the circuit card and radiates the thermal energy.
    Type: Application
    Filed: January 29, 2020
    Publication date: July 29, 2021
    Inventors: Isaac Q. Wang, Jordan H. Chin, James L. Petivan, Robert Boyd Curtis, Tim M. Spencer