Patents by Inventor Tim M. Sullivan

Tim M. Sullivan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Computing device bonding assemblies
    Patent number: 9927847
    Abstract: The description relates to computing devices, such as mobile computing devices. One example can include a first portion, a second portion, and an adhesive. The example can also include micro heaters positioned proximate to the adhesive. The micro heaters are configured to be selectively energized to supply sufficient thermal energy to the adhesive to facilitate curing of the adhesive.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: March 27, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Rajesh Dighde, Tim M. Sullivan
  • COMPUTING DEVICE BONDING ASSEMBLIES
    Publication number: 20170023989
    Abstract: The description relates to computing devices, such as mobile computing devices. One example can include a first portion, a second portion, and an adhesive. The example can also include micro heaters positioned proximate to the adhesive. The micro heaters are configured to be selectively energized to supply sufficient thermal energy to the adhesive to facilitate curing of the adhesive.
    Type: Application
    Filed: October 7, 2016
    Publication date: January 26, 2017
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Rajesh DIGHDE, Tim M. SULLIVAN
  • Computing device bonding assemblies
    Patent number: 9507383
    Abstract: The description relates to computing devices, such as mobile computing devices. One example can include a first portion, a second portion, and an adhesive. The example can also include micro heaters positioned proximate to the adhesive. The micro heaters are configured to be selectively energized to supply sufficient thermal energy to the adhesive to facilitate curing of the adhesive.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: November 29, 2016
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Rajesh Dighde, Tim M. Sullivan
  • COMPUTING DEVICE BONDING ASSEMBLIES
    Publication number: 20160091932
    Abstract: The description relates to computing devices, such as mobile computing devices. One example can include a first portion, a second portion, and an adhesive. The example can also include micro heaters positioned proximate to the adhesive. The micro heaters are configured to be selectively energized to supply sufficient thermal energy to the adhesive to facilitate curing of the adhesive.
    Type: Application
    Filed: September 30, 2014
    Publication date: March 31, 2016
    Applicant: Microsoft Corporation
    Inventors: Rajesh DIGHDE, Tim M. SULLIVAN
  • Process for manufacture of closure assembly
    Patent number: 5961911
    Abstract: A process for making a closure assembly includes placing a closure cap portion in a compression mold, introducing a melt of elastomer, pressing the melt into a septum against the cap and applying a foil barrier against the septum. The process may be performed in a rotary compression molding apparatus.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: October 5, 1999
    Assignee: Becton Dickinson and Company
    Inventors: Chorng-Fure Robin Hwang, Frank E. Martin, Tim M. Sullivan, Joel L. Williams