Patents by Inventor Tim Markey

Tim Markey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11698970
    Abstract: Methods, systems, and devices for double wrapping for verification are described. In some cases, a memory subsystem can receive a firmware image for the memory subsystem where the firmware image is signed with a first signature according to a first signing procedure. The memory subsystem can then verify an integrity of the firmware image based on the first signing procedure. After verifying the integrity of the firmware image, the memory subsystem can then generate a second signature for the firmware image based on a second signing procedure different from the first signing procedure. The memory subsystem can then write the second signature to the firmware image. The memory subsystem can then perform a verification process to verify the integrity of the firmware image based on one or both of the first signing procedure or the second signing procedure.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: July 11, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Tim Markey, James Ruane, Robert W. Strong
  • Publication number: 20220198019
    Abstract: Methods, systems, and devices for double wrapping for verification are described. In some cases, a memory subsystem can receive a firmware image for the memory subsystem where the firmware image is signed with a first signature according to a first signing procedure. The memory subsystem can then verify an integrity of the firmware image based on the first signing procedure. After verifying the integrity of the firmware image, the memory subsystem can then generate a second signature for the firmware image based on a second signing procedure different from the first signing procedure. The memory subsystem can then write the second signature to the firmware image. The memory subsystem can then perform a verification process to verify the integrity of the firmware image based on one or both of the first signing procedure or the second signing procedure.
    Type: Application
    Filed: December 28, 2021
    Publication date: June 23, 2022
    Inventors: Tim Markey, James Ruane, Robert W. Strong
  • Patent number: 11216562
    Abstract: Methods, systems, and devices for double wrapping for verification are described. In some cases, a memory subsystem can receive a firmware image for the memory subsystem where the firmware image is signed with a first signature according to a first signing procedure. The memory subsystem can then verify an integrity of the firmware image based on the first signing procedure. After verifying the integrity of the firmware image, the memory subsystem can then generate a second signature for the firmware image based on a second signing procedure different from the first signing procedure. The memory subsystem can then write the second signature to the firmware image. The memory subsystem can then perform a verification process to verify the integrity of the firmware image based on one or both of the first signing procedure or the second signing procedure.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: January 4, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Tim Markey, James Ruane, Robert W. Strong
  • Publication number: 20210200874
    Abstract: Methods, systems, and devices for double wrapping for verification are described. In some cases, a memory subsystem can receive a firmware image for the memory subsystem where the firmware image is signed with a first signature according to a first signing procedure. The memory subsystem can then verify an integrity of the firmware image based on the first signing procedure. After verifying the integrity of the firmware image, the memory subsystem can then generate a second signature for the firmware image based on a second signing procedure different from the first signing procedure. The memory subsystem can then write the second signature to the firmware image. The memory subsystem can then perform a verification process to verify the integrity of the firmware image based on one or both of the first signing procedure or the second signing procedure.
    Type: Application
    Filed: December 31, 2019
    Publication date: July 1, 2021
    Inventors: Tim Markey, James Ruane, Robert W. Strong