Abstract: A modular electronic architecture according to which electrical components are distributed across substantially identical, interconnected circuit elements or assemblies is provided. Scaling of the electronic device can be achieved by selecting different numbers of circuit elements. Embodiments of the present invention may also provide for a compact assembly, formed from interconnection of separate circuit boards in a stack. Particular applications include the provision of beam forming networks in connection with phased array antennas in which the beam forming networks are formed on circuit boards having an area that is about the same size as the area of a circuit board on which the antenna elements are formed.