Abstract: A method and system for reducing power consumption when processing mathematical operations. Power may be reduced in processor hardware devices that receive one or more operands from an execution unit that executes instructions. A circuit detects when at least one operand of multiple operands is a zero operand, prior to the operand being forwarded to an execution component for completing a mathematical operation. When at least one operand is a zero operand or at least one operand is “unordered”, a flag is set that triggers a gating of a clock signal. The gating of the clock signal disables one or more processing stages and/or devices, which perform the mathematical operation. Disabling the stages and/or devices enables computing the correct result of the mathematical operation on a reduced data path. When a device(s) is disabled, the device may be powered off until the device is again required by subsequent operations.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A mechanism is provided for efficiently recycling a charge from a power domain that is discharging. A side of a discharging power domain normally coupled to a voltage supply is disconnected from the voltage supply. The side of the precharging power domain normally coupled to the voltage supply is currently disconnected from the voltage supply. The side of the discharging power domain normally coupled to the voltage supply is connected to a side of the precharging power domain normally coupled to the voltage supply. A side of the discharging power domain normally coupled to the ground is disconnected from ground. The side of the discharging power domain normally coupled to ground is connected to the voltage supply, thereby precharging the precharging power domain with the charge from the discharging power domain that would normally he lost due to leakage.

Abstract: A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the mechanism, the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism. In the mechanism, the power delivery layer comprises a plurality of conductors, a plurality of insulating materials, one or more ground planes, and a plurality of through laminate vias. In the mechanism, the signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A technique for manufacturing a three-dimensional integrated circuit includes stacking a memory unit on a first die that includes a first computational unit. In this case, the memory unit is included in a second die. A second computational unit that is included in a third die is stacked on the second die. Sets of vertical vias that extend through the first, second, and third dies are connected to connect components of the first and second computational units and the memory unit. Multiplexers of the first and second computational units are configured to selectively couple the components to different ones of the sets of vertical vias responsive to respective control words for each of the first and third dies.

Abstract: A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A method of power gating a microprocessor having an instruction scheduling unit for receiving issued instructions from an instruction decoder; an execution unit receiving and sending signals from and to the instruction scheduling unit; and a state machine. The method comprises: obtaining a number of instructions per cycle being issued to the instruction scheduling unit; determining, if the number of instruction per cycle being issued to the instruction scheduling unit is less than a threshold level, and then determining if at least two of the instructions being issued to the instruction scheduling unit are independent of each other only when the instructions per cycle is less than the threshold level; determining when at least two of the instructions being issued to the instruction scheduling unit are independent of each other; and power gating the microprocessor to gate off power to idle macros with a signal from the state machine.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A method and system for reducing power consumption when processing mathematical operations. Power may be reduced in processor hardware devices that receive one or more operands from an execution unit that executes instructions. A circuit detects when at least one operand of multiple operands is a zero operand, prior to the operand being forwarded to an execution component for completing a mathematical operation. When at least one operand is a zero operand or at least one operand is “unordered”, a flag is set that triggers a gating of a clock signal. The gating of the clock signal disables one or more processing stages and/or devices, which perform the mathematical operation. Disabling the stages and/or devices enables computing the correct result of the mathematical operation on a reduced data path. When a device(s) is disabled, the device may be powered off until the device is again required by subsequent operations.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A method, system and computer program product for reducing power consumption when processing mathematical operations. Power may be reduced in processor hardware devices that receive one or more operands from an execution unit that executes instructions. A circuit detects when at least one operand of multiple operands is a zero operand, prior to the operand being forwarded to an execution component for completing a mathematical operation. When at least one operand is a zero operand or at least one operand is “unordered”, a flag is set that triggers a gating of a clock signal. The gating of the clock signal disables one or more processing stages and/or devices, which perform the mathematical operation. Disabling the stages and/or devices enables computing the correct result of the mathematical operation on a reduced data path. When a device(s) is disabled, the device may be powered off until the device is again required by subsequent operations.

Abstract: A method of power gating a microprocessor having an instruction scheduling unit for receiving issued instructions from an instruction decode unit; an execution unit coupled to receive and send signals from and to the instruction scheduling unit; and a state machine located within the execution unit, the method comprises: obtaining a number of instructions per cycle being issued to the instruction scheduling unit; determining, subsequent to obtaining the number of instructions per cycle, if the number of instruction per cycle being issued to the instruction scheduling unit is less than a threshold level, and then determining if at least two of the instructions being issued to the instruction scheduling unit are independent of each other only when the instructions per cycle is less than the threshold level; determining when at least two of the instructions being issued to the instruction scheduling unit are independent of each other; and power gating the microprocessor to gate off power to idle macros with a si

Abstract: An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.

Abstract: An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.

Abstract: Various systems, apparatuses, processes, and programs may be used to calculate a multiply-sum of two carry-less multiplications of two input operands. In particular implementations, a system, apparatus, process, and program may include the ability to use input data busses for the input operands and an output data bus for an overall calculation result, each bus including a width of 2n bits, where n is an integer greater than one. The system, apparatus, process, and program may also calculate the carry-less multiplications of the two input operands for a lower level of a hierarchical structure and calculating the at least one multiply-sum and at least one intermediate multiply-sum for a higher level of the structure based on the carry-less multiplications of the lower level. A certain number of multiply-sums may be output as an overall calculation result dependent on mode of operation using the full width of said output data bus.

Abstract: An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n?1 and N?2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.

Abstract: Various systems, apparatuses, processes, and/or products may be used to calculate an SHA-2 hash function in a general-purpose processor. In some implementations, a system, apparatus, process, and/or product may include the ability to calculate at least one SHA-2 sigma function by using an execution unit adapted for performing a processor instruction, the execution unit including an integrated circuit primarily designed for calculating the SHA-2 sigma function(s), and calculating the SHA-2 hash function with general-purpose hardware processing components of the processor based on the sigma function(s). In certain implementations, the calculation of the SHA-2 sigma function(s) can be performed by the integrated circuit within a single instruction, allowing for a faster calculation of the SHA-2 hash function.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: Various systems and processes may be used to speed up multi-threaded execution. In certain implementations, a system and process may include the ability to write results of a first group of execution units associated with a first register file into the first register file using a first write port of the first register file and write results of a second group of execution units associated with a second register file into the second register file using a first write port of the second register file. The system, apparatus, and process may also include the ability to connect, in a shared register file mode, results of the second group of execution units to a second write port of the first register file and connect, in a split register file mode, results of a part of the first group of execution units to the second write port of the first register file.

Abstract: A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the mechanism, the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism. In the mechanism, the power delivery layer comprises a plurality of conductors, a plurality of insulating materials, one or more ground planes, and a plurality of through laminate vias. In the mechanism, the signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.