Patents by Inventor Tim Philips

Tim Philips has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Monolithic power converter package
    Patent number: 9041175
    Abstract: According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. A high side power input, a low side power input, and a power output of the half-bridge are each disposed on a top surface of the monolithic die. The high side power input is electrically and mechanically coupled to the substrate by a high side power strip. Also, the low side power input is electrically and mechanically coupled to the substrate by a low side power strip. Furthermore, the power output is electrically and mechanically coupled to the substrate by a power output strip.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: May 26, 2015
    Assignee: International Rectifier Corporation
    Inventors: Eung San Cho, Dean Fernando, Tim Philips, Dan Clavette
  • Monolithic Power Converter Package with Through Substrate vias
    Patent number: 8901742
    Abstract: According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. The high side power input and a power output of the half-bridge each are disposed on a top surface of the monolithic die. The high side power input is electrically coupled to the substrate through a high side power connection. The power output is electrically coupled to the substrate through a power output connection. The low side power input of the half-bridge comprises a plurality of through substrate vias that extend through the monolithic die to electrically connect a low side power pad to the monolithic die.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: December 2, 2014
    Assignee: International Rectifier Corporation
    Inventors: Eung San Cho, Dean Fernando, Tim Philips, Dan Clavette
  • Monolithic Power Converter Package with Through Substrate Vias
    Publication number: 20130256905
    Abstract: According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. The high side power input and a power output of the half-bridge each are disposed on a top surface of the monolithic die. The high side power input is electrically coupled to the substrate through a high side power connection. The power output is electrically coupled to the substrate through a power output connection. The low side power input of the half-bridge comprises a plurality of through substrate vias that extend through the monolithic die to electrically connect a low side power pad to the monolithic die.
    Type: Application
    Filed: October 19, 2012
    Publication date: October 3, 2013
    Applicant: INTERNATIONAL RECTIFIER CORPORATION
    Inventors: Eung San Cho, Dean Fernando, Tim Philips, Dan Clavette
  • Monolithic Power Converter Package
    Publication number: 20130257524
    Abstract: According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. A high side power input, a low side power input, and a power output of the half-bridge are each disposed on a top surface of the monolithic die. The high side power input is electrically and mechanically coupled to the substrate by a high side power strip. Also, the low side power input is electrically and mechanically coupled to the substrate by a low side power strip. Furthermore, the power output is electrically and mechanically coupled to the substrate by a power output strip.
    Type: Application
    Filed: October 19, 2012
    Publication date: October 3, 2013
    Inventors: Eung San Cho, Dean Fernando, Tim Philips, Dan Clavette