Abstract: Socket warpage reduction apparatus and method including a socket comprising a socket housing having a surface mount region for an electrical device, and at least one rigid bar secured in a groove in the socket housing and contiguous the surface mount region to ensure the surface mount region is flat and remains flattened in varying ambient conditions.

Abstract: A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert conditions and substantially without the use of a solder flux. Also described, is a heat dissipating device having a thermal interface material layer bonded thereto for thermal coupling to a heat conducting component by an impermanent attachment.

Abstract: A socket for a microelectronic component is provided. The socket contains power, ground and signal conductors. It further contains a plurality of electrical conductors, each with a respective stop component, interconnection element, spring portion and protrusions. A plurality of protrusions is equal amongst each respective electrical conductor and identical in height. A plurality of electrical conductors are inserted into a respective opening within the socket body, a select plurality of electrical conductors electrically connects, via protrusions that frictionally fit, to either a power, ground or signal plane for the purpose of providing current to the integrated circuit. While a first plurality of electrical conductors are electrically connected through the same power, ground or signal conductor, they are also electrically disconnected from a second plurality of electrical conductors that are electrically connected though another conductors, not the same as the first.

Abstract: According to one embodiment of the present invention, an integrated socket is disclosed. The socket includes a socket grid to receive one or more pins from a component, a frame coupled to the socket grid to provide structural support, and a cable receptacle integrated into the socket to receive a cable.

Abstract: The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.

Abstract: A land grid array socket may receive an integrated circuit package for electrical connection thereto through lands on the integrated circuit package and spring contacts which extend upwardly to engage those lands from the socket. A protector plate may be situated over the spring contacts prior to the time at which the integrated circuit package is assembled onto the socket. As a result, the spring contacts on the socket may be prevented from damage prior to the time that they are engaged by the integrated circuit package.

Abstract: A pivotally mounted load plate may be provided with downwardly extending protrusions that engage corresponding slots in an integral heat spreader. As a result, when the load plate is rotated onto the integral heat spreader, alignment may be maintained.

Abstract: A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert conditions and substantially without the use of a solder flux. Also described, is a heat dissipating device having a thermal interface material layer bonded thereto for thermal coupling to a heat conducting component by an impermanent attachment.

Abstract: A socket for a microelectronic component is provided. The socket contains power, ground and signal conductors. It further contains a plurality of electrical conductors, each with a respective stop component, interconnection element, spring portion and protrusions. A plurality of protrusions is equal amongst each respective electrical conductor and identical in height. A plurality of electrical conductors are inserted into a respective opening within the socket body, a select plurality of electrical conductors electrically connects, via protrusions that frictionally fit, to either a power, ground or signal plane for the purpose of providing current to the integrated circuit. While a first plurality of electrical conductors are electrically connected through the same power, ground or signal conductor, they are also electrically disconnected from a second plurality of electrical conductors that are electrically connected though another conductors, not the same as the first.

Abstract: Embodiments of the invention provide a membrane for a land grid array (LGA) that reduces the likelihood and extent of deformation of the LGA contacts, as well as contamination thereof by foreign material. For one embodiment, the LGA has a number of holes formed therein that correspond to the LGA contacts and allow electrical coupling of the LGA contacts and pads of an IC device. For an alternative embodiment, the membrane has a number of conductive pads that correspond to the LGA contacts. These pads interface, in place of the LGA contacts, with the IC device pads, providing electrical connection between the IC device pads and the LGA contacts.