Patents by Inventor Tim ROOLF

Tim ROOLF has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12663141
    Abstract: A housing assembly for an electronic device, including a connection side on which at least one connection is provided, a first longitudinal side, a second longitudinal side, a first front side, and a second front side. The sides each have at least one housing wall. The housing assembly has at least two indicator lights having one luminous area. The luminous areas are arranged so as to be distributed along the housing assembly such that in an activated state, the luminous areas together emit light signals at least into a hemispherical region around the housing assembly.
    Type: Grant
    Filed: January 8, 2025
    Date of Patent: June 23, 2026
    Assignee: Murrelektronik GmbH
    Inventors: Tim Roolf, Heiko Feisst, Jan Maier, Henrik Ruf
  • Publication number: 20250324531
    Abstract: The invention relates to a connection device for a decentralized automation platform, comprising: a set of main and secondary connections for electrically connecting multiple functional modules in a connection area; one or more main connection surfaces with main connections; at least one guide surface positioned at a defined angle to the main connection surface to mechanically guide and support module assembly; a base body with a housing and a connection arrangement electrically linked to the main and/or secondary connections to interconnect the functional modules; and electrical lines within the housing to supply main energy, auxiliary energy, and data flow to operate the automation platform for controlling industrial plant devices.
    Type: Application
    Filed: April 4, 2025
    Publication date: October 16, 2025
    Inventors: Luca Hoffmann, Olaf Prein, Heiko Feisst, Tim Roolf
  • Publication number: 20250323434
    Abstract: The invention relates to a connecting device (10) for an automation platform, comprising a contacting receiving element (12) which is configured to provide contacting with a contacting element (22) of a functional module (20) corresponding to the contacting receiving element (12) and to provide at least one of a main energy flow, an auxiliary energy flow and a data flow to the functional module (20) and a grounding receiving element (15) which is configured to provide grounding for the functional module.
    Type: Application
    Filed: March 26, 2025
    Publication date: October 16, 2025
    Inventors: Olaf Prein, Heiko Feisst, Tim Roolf
  • Publication number: 20250324537
    Abstract: Disclosed herein is a functional module for forming a decentralized automation platform that the functional module is modularly connected to a plurality of further functional modules to provide a plurality of functions for the automation of an industrial plant in a modular manner, having: an electronic arrangement for providing at least one of the plurality of functions, a base body with a base body housing in which the electronic arrangement is arranged, a connection arrangement, arranged on the base body housing and/or is electrically connected to the electronics arrangement to provide an electrical connection for one of the plurality of further functional modules, wherein the connection arrangement is designed to provide a main energy flow, an auxiliary energy flow and a data flow between the functional module and the connected further functional module i to operate the automation platform for automation of the industrial plant.
    Type: Application
    Filed: April 7, 2025
    Publication date: October 16, 2025
    Inventors: Olaf Prein, Heiko Feisst, Tim Roolf
  • Publication number: 20250224094
    Abstract: A housing assembly for an electronic device, including a connection side on which at least one connection is provided, a first longitudinal side, a second longitudinal side, a first front side, and a second front side. The sides each have at least one housing wall. The housing assembly has at least two indicator lights having one luminous area. The luminous areas are arranged so as to be distributed along the housing assembly such that in an activated state, the luminous areas together emit light signals at least into a hemispherical region around the housing assembly. An electronic device is furthermore described.
    Type: Application
    Filed: January 8, 2025
    Publication date: July 10, 2025
    Inventors: Tim ROOLF, Heiko FEISST, Jan MAIER, Henrik RUF
  • Publication number: 20250174096
    Abstract: An electrical device with an indicator light includes a housing and a light source which is arranged in the housing and is set up to couple light into a housing wall of the housing, which propagates through the material of the housing wall to a light-decoupling part of the housing. The light emitted by the light source can exit the housing through the light-decoupling part of the housing. The indicator light is formed by at least the light-decoupling part of the housing. The light-decoupling part of the housing or a non-light-decoupling part of the housing which delimits the light-decoupling part of the housing is produced by a local mechanical, chemical and/or physical treatment of the housing. The treatment is carried out in a fully assembled state of the electrical device. Furthermore, embodiments of the present disclosure relate to a method of manufacturing the electrical device.
    Type: Application
    Filed: November 22, 2024
    Publication date: May 29, 2025
    Inventors: Tim ROOLF, Heiko FEIßT, Henrik RUF
  • Publication number: 20240357753
    Abstract: A printed circuit board assembly for a field bus device is described, comprising a housing, a printed circuit board, and at least one electronic component fastened to the printed circuit board. The printed circuit board is arranged in the housing. The housing has at least one bearing surface on which a gap filler is arranged, against which the electronic component rests so that the printed circuit board is mounted in the housing via the electronic component and the gap filler. A potting compound is provided, which covers the printed circuit board and contacts the gap filler.
    Type: Application
    Filed: April 17, 2024
    Publication date: October 24, 2024
    Inventors: Heiko FEISST, Jan MAIER, Tim ROOLF, Henrik RUF