Abstract: Concepts for measuring and monitoring characteristics of osseous tissue are presented. In various embodiments, a monitoring probe may be inserted through a hollow passageway within a cannulated screw during an operation in order to measure characteristics of the osseous tissue in which the cannulated screw is inserted. In various embodiments, the cannulated screw may be inserted into a femoral head, through a physis, and into an epiphysis for stabilization of Slipped Capital Femoral Epiphysis. During surgical treatment thereof, a pressure transducer may be inserted into the osseous tissue through the cannulated screw in order to monitor epiphysis perfusion through the femoral head.

Abstract: Concepts for measuring and monitoring characteristics of osseous tissue are presented. In various embodiments, a monitoring probe may be inserted through a hollow passageway within a cannulated screw during an operation in order to measure characteristics of the osseous tissue in which the cannulated screw is inserted. In various embodiments, the cannulated screw may be inserted into a femoral head, through a physis, and into an epiphysis for stabilization of Slipped Capital Femoral Epiphysis. During surgical treatment thereof, a pressure transducer may be inserted into the osseous tissue through the cannulated screw in order to monitor epiphysis perfusion through the femoral head.

Abstract: The present disclosure describes swivel hinge assemblies for use in rotatably mounting two structures together, such that the structures are in fluid communication by way of fluid flow, as well as systems including such hinge assemblies. The swivel hinge assemblies generally comprise a fluid inlet port, a fluid outlet port, shafts surrounding the inlet and outlet ports and allowing for rotation about one or more axes, and attachment means which may be integrally formed with the shafts of the hinge assembly. In use, these assemblies eliminate the use for secondary hinges or secondary mounting hardware in attaching a door and a structure together in order to maintain fluid communication between an electronics rack and a heat exchanger mounted on the door of an electronics rack.

Abstract: Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

Abstract: A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis.

Abstract: The present disclosure describes swivel hinge assemblies for use in rotatably mounting two structures together, such that the structures are in fluid communication by way of fluid flow, as well as systems including such hinge assemblies. The swivel hinge assemblies generally comprise a fluid inlet port, a fluid outlet port, shafts surrounding the inlet and outlet ports and allowing for rotation about one or more axes, and attachment means which may be integrally formed with the shafts of the hinge assembly. In use, these assemblies eliminate the use for secondary hinges or secondary mounting hardware in attaching a door and a structure together in order to maintain fluid communication between an electronics rack and a heat exchanger mounted on the door of an electronics rack.

Abstract: A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis.

Abstract: Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.