Patents by Inventor Tim Schwegler

Tim Schwegler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030002240
    Abstract: An electrical device having components (1, 2, 3) that are arranged in a casing (4; 10) and are electromagnetically shielded in an outward manner. In the casing, spaces provided between the casing and the components as well as between the components themselves are completely filled with plastic parts (5, 6; 13) provided with ferrite particles (9). These plastic parts are preferably provided in the form of shaped plastic parts in which the components are held with form fit.
    Type: Application
    Filed: April 1, 2002
    Publication date: January 2, 2003
    Applicant: SIEMENS AG
    Inventors: Peter Lindmueller, Michael Ludwig, Tim Schwegler
  • Patent number: 5682289
    Abstract: A chassis of a device, for example an electronic device, comprises a support unit made of plastic material which carries the components of the device, such as printed circuit boards, a data storage disk, a ventilator, and a loudspeaker. The components are held in place in corresponding recesses of the chassis by a form-locking connection with the plastic material. The components are carried by the chassis without requiring any fastening elements. For assembling the device, the components are inserted into the lower part of the chassis. Thereafter, the upper part is positioned on top of the lower part. The chassis can be enclosed in a metal enclosure. The chassis is preferably manufactured by a plastic molding process. Ventilation ducts can be provided in the plastic material to ensure cooling of the components.
    Type: Grant
    Filed: September 22, 1995
    Date of Patent: October 28, 1997
    Assignee: Hewlett-Packard Company
    Inventors: Tim Schwegler, Juergen Haeberle, Siegfried Kopp, Johannes Mahn
  • Patent number: 5594623
    Abstract: An improved attachment method for attaching an heat sink to a integrated circuit package, which includes an heat spreader with a dove-tail feature attached to an upper surface of the integrated circuit package. The bottom surface of the heat sink has a dove-tail feature that matingly corresponds to the dove-tail feature of the heat spreader, such that the heat sink can be slide onto the heat spreader. The heat sink is prevented from sliding off of the heat spreader by a clip. A fan may be attached to the top surface of the heat sink using a clip that attaches to an outer edge of the heat sink or by making the outer two fins on the heat sink slightly taller than the fan with an inward dove-tail so that the fan can slide snugly between the top of the inner fins and the dove-tails of the outer two fins.
    Type: Grant
    Filed: March 14, 1996
    Date of Patent: January 14, 1997
    Assignee: Hewlett-Packard Co
    Inventor: Tim Schwegler
  • Patent number: 5473507
    Abstract: A chassis of a device, for example an electronic device, includes a support unit made of plastic material which carries the components of the device, such as printed circuit boards, a data storage disk, a ventilator, and a loudspeaker. The components are held in place in corresponding recesses of the chassis by a form-locking connection with the plastic material. The components are carried by the chassis without requiring any fastening elements. For assembling the device, the components are inserted into the lower part of the chassis. Thereafter, the upper part is positioned on top of the lower part. The chassis can be enclosed in a metal enclosure. The chassis is preferably manufactured by a plastic molding process. Ventilation ducts can be provided in the plastic material to ensure cooling of the components.
    Type: Grant
    Filed: March 21, 1994
    Date of Patent: December 5, 1995
    Assignee: Hewlett-Packard Company
    Inventors: Tim Schwegler, Juergen Haeberle, Siegfried Kopp, Johannes Mahn
  • Patent number: 5369549
    Abstract: A device casing includes at least two casing parts, which are held together by corner parts that are pushed over the corners of the casing parts. Locking elements are provided to connect the corner parts with the casing parts. The locking elements prevent the corner parts coming away from the casing once assembled.
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: November 29, 1994
    Assignee: Hewlett-Packard Company
    Inventors: Siegfried Kopp, Juergen Haeberle, Johannes Mahn, Tim Schwegler, Malte Schlueter