Patents by Inventor Tim Scovell

Tim Scovell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and system for removing photoresist through the use of hot deionized water bath, water vapor and ozone gas
    Patent number: 6622738
    Abstract: An apparatus and system for removing photoresist or other organic material from a substrate such as a semiconductor wafer is provided. The apparatus and system includes a chamber for partially immersing the substrate in a solvent (e.g., deionized water), a chamber for receiving an oxidizing gas (e.g., ozone), and a mechanism for rotating or otherwise moving the substrate through the solvent to coat a thin film of solvent over the organic component on the substrate surface and expose the solvent-coated substrate to the ozone gas.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: September 23, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Tim Scovell
  • Removal of photoresist through the use of hot deionized water bath, water vapor and ozone gas
    Patent number: 6558477
    Abstract: A method for removing photoresist or other organic material from a substrate such as a semiconductor wafer is provided. The method includes partially immersing the substrate in a solvent (e.g., deionized water) in a reaction chamber, injecting an oxidizing gas (e.g., ozone) into the reaction chamber, and rotating or otherwise moving the substrate through the solvent to coat a thin film of solvent over the organic component on the substrate surface and expose the solvent-coated substrate to the ozone gas to remove the organic material from the surface.
    Type: Grant
    Filed: October 16, 2000
    Date of Patent: May 6, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Tim Scovell
  • Removal of photoresist through the use of hot deionized water bath, water vapor and ozone gas
    Publication number: 20020134409
    Abstract: A method for removing photoresist or other organic material from a substrate such as a semiconductor wafer is provided. The method includes partially immersing the substrate in a solvent (e.g., deionized water) in a reaction chamber, injecting an oxidizing gas (e.g., ozone) into the reaction chamber, and rotating or otherwise moving the substrate through the solvent to coat a thin film of solvent over the organic component on the substrate surface and expose the solvent-coated substrate to the ozone gas to remove the organic material from the surface.
    Type: Application
    Filed: April 24, 2002
    Publication date: September 26, 2002
    Applicant: Micron Technology, Inc.
    Inventor: Tim Scovell