Patents by Inventor Tim Simpson

Tim Simpson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dissolving metal supports in 3D printed metals and ceramics using sensitization
    Patent number: 11504770
    Abstract: Systems and methods are disclosed for fabricating a metal or ceramic component using a 3D printer. An entire 3D printed piece, including both the metal or ceramic component and one or more support structures, is created of a first metal or ceramic material. A sensitization layer is applied to all or part of the 3D printed piece to chemically alter portions of the first metal or ceramic material near the surface making those portions of the material more sensitive to the etching process. The etching process causes the affected material to deplete and separates the component from the support structures without requiring mechanical machining.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: November 22, 2022
    Assignees: ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY, THE PENN STATE RESEARCH FOUNDATION
    Inventors: Owen Hildreth, David Wright, Abdalla Nassar, Tim Simpson, Christopher Lefky
  • DISSOLVING METAL SUPPORTS IN 3D PRINTED METALS AND CERAMICS USING SENSITIZATION
    Publication number: 20190314895
    Abstract: Systems and methods are disclosed for fabricating a metal or ceramic component using a 3D printer. An entire 3D printed piece, including both the metal or ceramic component and one or more support structures, is created of a first metal or ceramic material. A sensitization layer is applied to all or part of the 3D printed piece to chemically alter portions of the first metal or ceramic material near the surface making those portions of the material more sensitive to the etching process. The etching process causes the affected material to deplete and separates the component from the support structures without requiring mechanical machining.
    Type: Application
    Filed: February 16, 2017
    Publication date: October 17, 2019
    Inventors: Owen Hildreth, David Wright, Abdalla Nassar, Tim Simpson, Christopher Lefky