Patents by Inventor Tim VANGERVEN
Tim VANGERVEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240003940Abstract: A current sensor system has a conductor and a packaged integrated circuit for sensing a current in the conductor. The conductor is external to the packaged integrated circuit. The packaged integrated circuit includes a substrate having an active surface and a back surface; one or more magnetic sensing elements; a processing circuit arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor; a housing; a plurality of leads; electrical connections between the leads and the active surface. The back surface of the substrate is disposed on a support formed by at least two inner lead portions of the plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.Type: ApplicationFiled: September 15, 2023Publication date: January 4, 2024Inventors: Lucian BARBUT, Simon HOUIS, Lionel TOMBEZ, Tim VANGERVEN
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Patent number: 11796572Abstract: A current sensor system has a conductor and a packaged integrated circuit for sensing a current in the conductor. The conductor is external to the packaged integrated circuit. The packaged integrated circuit includes a substrate having an active surface and a back surface; one or more magnetic sensing elements; a processing circuit arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor; a housing; a plurality of leads; electrical connections between the leads and the active surface. The back surface of the substrate is disposed on a support formed by at least two inner lead portions of the plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.Type: GrantFiled: October 29, 2021Date of Patent: October 24, 2023Assignee: MELEXIS TECHNOLOGIES SAInventors: Lucian Barbut, Simon Houis, Lionel Tombez, Tim Vangerven
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Publication number: 20230314485Abstract: A current sensor is described comprising an integrated circuit for sensing electric currents comprising an active side, the active side comprising at least one sensing element and at least one contact pad and a housing comprising material embedding the integrated circuit arranged for allowing electric connection to the at least two contact pads of the active side of the integrated circuit. The housing comprises at least one conductive via disposed outside the integrated circuit and connected to the at least one contact pad, for distributing signals from the at least one contact pad through the housing away from the active side of the integrated circuit.Type: ApplicationFiled: June 1, 2023Publication date: October 5, 2023Inventors: Tim VANGERVEN, Appolonius Jacobus VAN DER WIEL
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Patent number: 11698394Abstract: A current sensor is described comprising an integrated circuit for sensing electric currents comprising an active side, the active side comprising at least one sensing element and at least one contact pad and a housing comprising material embedding the integrated circuit arranged for allowing electric connection to the at least two contact pads of the active side of the integrated circuit. The housing comprises at least one conductive via disposed outside the integrated circuit and connected to the at least one contact pad, for distributing signals from the at least one contact pad through the housing away from the active side of the integrated circuit.Type: GrantFiled: March 23, 2020Date of Patent: July 11, 2023Assignee: MELEXIS TECHNOLOGIES SAInventors: Tim Vangerven, Appolonius Jacobus Van Der Wiel
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Publication number: 20230160927Abstract: A method of manufacture of a sensor and a sensor for sensing a magnetic field generated by a current in a conductive substrate includes a first substrate having a sensing element for sensing magnetic field, and a second substrate is the conductive substrate. A conformal layer is provided by atomic layer deposition between the first substrate and the second substrate, thus protecting at least the sensing element from discharge from the second substrate.Type: ApplicationFiled: November 23, 2022Publication date: May 25, 2023Inventors: Brecht PUT, Tim VANGERVEN
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Publication number: 20220412791Abstract: A weight sensor comprises a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece by a product due to the weight of said product, the displacement of the target piece with respect to sensing elements can be sensed.Type: ApplicationFiled: June 27, 2022Publication date: December 29, 2022Inventors: Gael CLOSE, Jerome DEGOIS, Nicolas DUPRE, Theo LE SIGNOR, Tim VANGERVEN
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Publication number: 20220412816Abstract: A force sensor has a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. A semiconductor package includes at least the integrated circuit. A flexible piece includes the target, and it is attached to the semiconductor package. The attachment area between the flexible piece and the semiconductor package does not extend beyond the top projection, or outline, of the semiconductor package. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece, the displacement of the target piece with respect to the surface of the semiconductor package can be sensed by the sensing element.Type: ApplicationFiled: June 27, 2022Publication date: December 29, 2022Inventors: Nicolas DUPRE, Gael CLOSE, Theo LE SIGNOR, Tim VANGERVEN
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Publication number: 20220137100Abstract: A current sensor system has a conductor and a packaged integrated circuit for sensing a current in the conductor. The conductor is external to the packaged integrated circuit. The packaged integrated circuit includes a substrate having an active surface and a back surface; one or more magnetic sensing elements; a processing circuit arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor; a housing; a plurality of leads; electrical connections between the leads and the active surface. The back surface of the substrate is disposed on a support formed by at least two inner lead portions of the plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.Type: ApplicationFiled: October 29, 2021Publication date: May 5, 2022Inventors: Lucian BARBUT, Simon HOUIS, Lionel TOMBEZ, Tim VANGERVEN
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Publication number: 20200300898Abstract: A current sensor is described comprising an integrated circuit for sensing electric currents comprising an active side, the active side comprising at least one sensing element and at least one contact pad and a housing comprising material embedding the integrated circuit arranged for allowing electric connection to the at least two contact pads of the active side of the integrated circuit. The housing comprises at least one conductive via disposed outside the integrated circuit and connected to the at least one contact pad, for distributing signals from the at least one contact pad through the housing away from the active side of the integrated circuit.Type: ApplicationFiled: March 23, 2020Publication date: September 24, 2020Inventors: Tim VANGERVEN, Appolonius Jacobus VAN DER WIEL