Patents by Inventor Tim Welters

Tim Welters has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DUAL CURE POLYURETHANE FORMULATIONS FOR 3D PRINTING APPLICATIONS
    Publication number: 20220055285
    Abstract: The present invention lies in the field of 3D printing methods. In particular, the invention relates to 3D printing methods for the production of a 3D part in a layer-by-layer manner, wherein the printable composition is a pasty polyurethane composition comprising at least one polyisocyanate resin, at least one monomer and/or prepolymer that is polymerizable by exposure to radiation and at least one photoinitiator, wherein the pasty polyurethane composition has a viscosity factor (1.5/15) of at least 2 at application temperature.
    Type: Application
    Filed: November 8, 2021
    Publication date: February 24, 2022
    Inventors: Sascha Poeller, Manuel Schiel, Tanja Rossberg, Andreas Ferencz, Tim Welters, Uwe Franken
  • DUAL CURE EPOXY FORMULATIONS FOR 3D PRINTING APPLICATIONS
    Publication number: 20220055286
    Abstract: The present invention lies in the field of 3D printing methods. In particular, the invention relates to 3D printing methods for the production of a 3D part in a layer-by-layer manner, wherein the printable composition is a pasty epoxy composition comprising at least one epoxy resin, at least one monomer and/or prepolymer that is polymerizable by exposure to radiation and at least one photoinitiator, wherein the pasty epoxy composition has a viscosity factor (1.5/15) of at least 2 at application temperature.
    Type: Application
    Filed: November 8, 2021
    Publication date: February 24, 2022
    Inventors: Sascha Poeller, Tanja Rossberg, Ligang Zhao, Andreas Ferencz, Manuel Schiel, Tim Welters
  • Thermally expandable preparations
    Patent number: 9790341
    Abstract: The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: October 17, 2017
    Assignee: Henkel AG & Co. KGaA
    Inventors: Emilie Barriau, Martin Renkel, Rainer Schoenfeld, Sven Wucherpfennig, Tim Welters
  • THERMALLY EXPANDABLE PREPARATIONS
    Publication number: 20150064380
    Abstract: The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.
    Type: Application
    Filed: September 19, 2014
    Publication date: March 5, 2015
    Inventors: Emilie BARRIAU, Martin Renkel, Rainer Schoenfeld, Sven Wucherpfennig, Tim Welters