Abstract: A wire bond apparatus and method can include wire bonder head having a capillary there through and a bond wire within the capillary. A forming gas inlet to the capillary allows injection of forming gas directly into the wire bond head capillary. The forming gas can be forced from the end of the capillary to accurately envelop an end of the bond wire in forming gas during free-air ball formation, which can decrease oxidation of the free-air ball during formation, reduce a quantity of forming gas used, and result in a more symmetrical free-air ball and an improved bond wire attachment.