Patents by Inventor TIMER DEREQUITO PORRAS

TIMER DEREQUITO PORRAS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRE BONDING FOR INTERCONNECTION BETWEEN INTERPOSER AND FLIP CHIP DIE
    Publication number: 20120199960
    Abstract: An integrated circuit (IC) device includes an interposer having a dielectric substrate having a first side, a second side, and an inner aperture, wherein a plurality of electrically conductive traces are on the first side. An IC die includes a topside semiconductor surface having active circuitry and a bottomside surface, wherein the topside semiconductor surface includes a plurality of bond pads, and is attached over the inner aperture onto the interposer. First wirebond interconnects couple respective bond pads to respective electrically conductive traces. A workpiece includes a top workpiece surface including a plurality of contact pads thereon attached to the first side of the interposer. Second interconnects couple respective conductive traces to respective contact pads on the workpiece.
    Type: Application
    Filed: February 7, 2011
    Publication date: August 9, 2012
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: GLENN ENRICK CALDERON COSUE, EDGARDO RULLODA HORTALEZA, GERARDO CALDERON ANGELES, TIMER DEREQUITO PORRAS