Patents by Inventor Timo BANGERTER

Timo BANGERTER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal or metal alloy deposition composition and plating compound
    Patent number: 11512405
    Abstract: The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: November 29, 2022
    Assignee: Atotech Deutschland GmbH
    Inventors: Angela Llavona-Serrano, Timo Bangerter, Olivier Mann, Pamela Cebulla, Stefanie Ackermann, Heiko Brunner, Kinga Haubner, Bernd Froese
  • METAL OR METAL ALLOY DEPOSITION COMPOSITION AND PLATING COMPOUND
    Publication number: 20200340132
    Abstract: The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.
    Type: Application
    Filed: December 14, 2018
    Publication date: October 29, 2020
    Inventors: Angela LLAVONA-SERRANO, Timo BANGERTER, Olivier MANN, Pamela CEBULLA, Stefanie ACKERMANN, Heiko BRUNNER, Kinga HAUBNER, Bernd FROESE
  • Copper plating bath composition
    Patent number: 9551080
    Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: January 24, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Bernd Roelfs, Agnieszka Witczak, Lars Kohlmann, Olivier Mann, Christian Ohde, Timo Bangerter, Angelo Ferro, Andreas Kirbs, Andre Schmökel, Dirk Rohde, Stefanie Ackermann
  • COPPER PLATING BATH COMPOSITION
    Publication number: 20150299883
    Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
    Type: Application
    Filed: November 12, 2013
    Publication date: October 22, 2015
    Inventors: Heiko BRUNNER, Bernd ROELFS, Agnieszka WITCZAK, Lars KOHLMANN, Olivier MANN, Christian OHDE, Timo BANGERTER, Angelo FERRO, Andreas KIRBS, Andre SCHMÖKEL, Dirk ROHDE, Stefanie ACKERMANN