Abstract: The Directive 2002/95/EC of the European Parliament and of the Council promulgated that from 1 Jul. 2006 new electrical and electronic equipment must no longer contain lead. Accordingly, lead-free solder alloys for various electrical and electronic applications have been developed. But at present, lead in high melting temperature type solders, e.g. used for die-attach applications, are exempted from the directive due to lack of lead-free alternatives for these alloys. The present invention provides a lead-free die-attach composition for attaching high power semiconductor devices to printed circuit boards. The die-attach composition comprises a metal filled epoxy resin, wherein the metal is selected from a powder comprising copper and having spheroidal particles with less than half of the copper atoms in a surface layer being oxidized as measured by XPS.