Patents by Inventor TIMO HEIKKILA

TIMO HEIKKILA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230384341
    Abstract: A method for evaluating sensor data. In the method, firstly, raw sensor data and/or processed sensor data from at least one sensor are input and measurement data determined from the raw sensor data and/or the processed sensor data. The measurement data are then corrected on the basis of a mathematical model, wherein, on correction, drift of the raw sensor data and/or of the processed sensor data is determined and removed from the measurement data. The corrected measurement data are furthermore output.
    Type: Application
    Filed: May 25, 2023
    Publication date: November 30, 2023
    Inventors: Timo Heikkilä, Rui Zhang
  • Patent number: 10838098
    Abstract: A pill removal detection device for a blister package including a metallic element. Further, the pill removal detection device includes a detection means for detecting removal of a pill from the blister package. Yet further, the pill removal detection device includes an energy source, a sensor for detecting a change in capacitance of the metallic element of the blister package, means for communicating the detected change in capacitance to the detection means for waking up the detection means, and an attachment means for attaching the pill removal detection device to the blister package, the attachment means including an electrically conductive element connected to the sensor.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: November 17, 2020
    Assignee: Popit Oy
    Inventors: Timo Heikkilä, Marko Nirhola, Teemu Piirainen
  • Publication number: 20190196042
    Abstract: A pill removal detection device for a blister package including a metallic element. Further, the pill removal detection device includes a detection means for detecting removal of a pill from the blister package. Yet further, the pill removal detection device includes an energy source, a sensor for detecting a change in capacitance of the metallic element of the blister package, means for communicating the detected change in capacitance to the detection means for waking up the detection means, and an attachment means for attaching the pill removal detection device to the blister package, the attachment means including an electrically conductive element connected to the sensor.
    Type: Application
    Filed: November 21, 2018
    Publication date: June 27, 2019
    Inventors: Timo Heikkilä, Marko Nirhola, Teemu Piirainen
  • Patent number: 9743253
    Abstract: A method for locating an electronic mobile device capable of wireless communication, the method including obtaining a probability map structure for the area of interest, the probability map structure associating environment data values, preferably including cellular network based data, with location data, obtaining a number of probabilistic temporospatial motion models for different types of motion, the models at least partly defining transition probabilities between location estimates relative to time, obtaining at least environment data captured or determined by the mobile device at a plurality of sequential time instances, and determining the most probable location estimate of the mobile device based on combining probability data from both the probability map structure and the motion models, wherein the at least environment data is best fitted in the motion models and probability map structure according to predefined criteria. Related two arrangements and a computer program are presented.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: August 22, 2017
    Assignee: GLOPOS FZC
    Inventors: Timo Heikkila, Mikael Vainio
  • Publication number: 20170064515
    Abstract: A method for locating an electronic mobile device capable of wireless communication, the method including obtaining a probability map structure for the area of interest, the probability map structure associating environment data values, preferably including cellular network based data, with location data, obtaining a number of probabilistic temporospatial motion models for different types of motion, the models at least partly defining transition probabilities between location estimates relative to time, obtaining at least environment data captured or determined by the mobile device at a plurality of sequential time instances, and determining the most probable location estimate of the mobile device based on combining probability data from both the probability map structure and the motion models, wherein the at least environment data is best fitted in the motion models and probability map structure according to predefined criteria. Related two arrangements and a computer program are presented.
    Type: Application
    Filed: August 27, 2015
    Publication date: March 2, 2017
    Inventors: Timo HEIKKILA, Mikael VAINIO
  • Patent number: 9125019
    Abstract: Electronic arrangement for positioning a mobile device, including a mapping entity configured to obtain positioning data, from a plurality of measuring mobile devices present in an area of interest, establish and maintain, based on the obtained data, a multi-level probability map model structure for the area, wherein each higher level covers the area with lower spatial resolution by a plurality of determine sub-areas, each having a unitary character, and each lower level correspondingly covers, for each the sub-area of the adjacent upper level, a plurality of determined sub-areas thereof with higher spatial resolution, the lowest level determining the highest spatial resolution location elements of the model, optionally coordinates, a locating entity configured to obtain data provided by the mobile device, determine an estimate of the position of the mobile device by traversing through at least a portion of a number of vertical candidate paths of the multi-level probability model structure.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: September 1, 2015
    Assignee: GLOPOS FZC
    Inventors: Timo Heikkila, Mikael Vainio
  • Patent number: 8295853
    Abstract: A method and system for accurately determining the location of the mobile device (10) is disclosed. In the mapping phase collected reference positioning data and collected cell data are used to map a covered area estimation and in the actual location determination phase the covered area estimation is calculated from actual environment data received through wireless cellular communication network (11, 12) and possibly but not necessarily from external databases (17, 19). The covered area estimation comprises at least some of the following calculations: (i) estimation of base station location, (ii) estimation of transmission range, (iii) estimation of signal map and (iv) estimation of area type. The actual location of the mobile device (10) is determined from the covered area estimation based on relative comparison between the actual environment data and estimations (i)-(iv) and weight numbers resulted from the comparison.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: October 23, 2012
    Assignee: Glopos FZC
    Inventors: Timo Heikkilä, Anssi Jakorinne, Timo Kuisma, Jyrki Paananen, Arno Hietanen
  • Publication number: 20110091683
    Abstract: The invention relates to a post formable plywood product and method for manufacturing a post formable plywood product. The post formable plywood product is formed so that the veneers of the plywood are joined together. In accordance with the invention, the veneers are bound together by self-adhesive material formed of polyolefm film, and polyolefin film contains reactive groups with —OH groups of the wood for forming covalent bonds between the veneer and polyolefin film.
    Type: Application
    Filed: February 18, 2009
    Publication date: April 21, 2011
    Applicant: UPM-Kymmene Wood Oy
    Inventors: Samantha Kiljunen, Robin Wilén, Harri Nieminen, Timo Heikkilä
  • Patent number: 6481491
    Abstract: The invention relates to a device for removing heat from an electronic component mounted on a circuit board. The device uses a working fluid circulated through cooling elements which are integrated into a metal matrix composite structure. The cooling elements are positioned and arranged within the structure to efficiently manage heat dissipation by evacuating the heat from the component in a multi-directional manner.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: November 19, 2002
    Assignee: Nokia Telecommunications Oy
    Inventors: Carl Kabrell, Reijo Lehtiniemi, Jukka Rantala, Timo Heikkilä, Tapio Tuamainen
  • Publication number: 20020121359
    Abstract: The invention relates to a method of installing a heat source on a micro heat pipe module and to a micro heat pipe module. The micro heat pipe module (1) has micro heat pipes (3) for dissipating the thermal energy generated by the heat source (2) generating thermal energy, and the micro heat pipe module (1) has a side (4) on which the heat source (2) generating thermal energy is installed. The side (4) of the micro heat pipe module (1), on which the heat source (2) generating thermal energy is installed, is coated with a coating (5) made of a heat conducting material, which coating (5) is arranged to conduct the heat generated by the heat source (2) generating thermal energy away from the heat source (2) generating thermal energy along said side (4) of the micro heat pipe module (1) and to the micro heat pipe module (1).
    Type: Application
    Filed: December 27, 2001
    Publication date: September 5, 2002
    Inventors: Timo Heikkila, Carl Kabrell, Reijo Lehtiniemi, Jukka Rantala
  • Publication number: 20020117292
    Abstract: The invention relates to an arrangement for dissipating thermal energy generated by a heat source (1), which arrangement comprises a heat conductor element (2) for conducting thermal energy generated by the heat source (1) away from the heat source (1), the heat conductor element (2) having at least one micro heat pipe module (3) attached to it for distributing thermal energy generated by the heat source (1) in the heat conductor element (2). The heat source (1) is attached to an element (4) which is made of a heat conducting material and which is in thermal contact with the heat conductor element (2) and which is arranged to conduct thermal energy from the heat source (1) to the heat conductor element (2) by means of the heat conducting ability of said heat conducting material.
    Type: Application
    Filed: December 27, 2001
    Publication date: August 29, 2002
    Inventors: Timo Heikkila, Reijo Lehtiniemi, Carl Kabrell, Jukka Rantala
  • Publication number: 20020100579
    Abstract: An apparatus cabinet comprising one or more equipment bays, and at least one apparatus unit emitting heat in the equipment bay, the apparatus cabinet further comprising one or more inlets for drawing cooling air into the apparatus cabinet for cooling said apparatus unit, and one or more outlets for dissipating the air used for cooling from the apparatus cabinet, and the apparatus cabinet comprising a pressurization space and one or more fans interconnected to the pressurization space for changing the air pressure in the pressurization space to be different from the air pressure in the equipment bay, and a partition for separating the equipment bay and the pressurization space at least partly from one another, the partition comprising one or more air nozzles for conveying the air between the pressurization space and the equipment bay.
    Type: Application
    Filed: January 31, 2001
    Publication date: August 1, 2002
    Inventors: Timo Heikkila, Arto Hietala, Jouko HirvasKari
  • Publication number: 20010003305
    Abstract: The invention relates to a cooling apparatus (10) based on heat energy bound to working fluid in phase transition, the cooling apparatus comprising, for conducting elsewhere the heat energy generated by an electronic component (7), elongated cooling elements (1; 6a, 6b; 9a-9f) containing working fluid and extending in at least two different directions forming a matrix of cooling elements, and a heat conducting material (8; 15) binding the matrix of the cooling elements. The cooling elements (6a, 6b; 9a-9f) are arranged parallel to a circuit board level (A) and in at least one direction deviating from the circuit board level (A).
    Type: Application
    Filed: November 22, 1999
    Publication date: June 14, 2001
    Inventors: CARL KABRELL, REIJO LEHTINIEMI, JUKKA RANTALA, TIMO HEIKKILA, RAIJA KYLLIKKI TUOMAINEN, KIMMO VELI TAPIO TUOMAINEN, KARI-PEKKA MIKAEL TUOMAINEN