Patents by Inventor Timo Henttonen

Timo Henttonen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked package integrated circuit
    Patent number: 7265442
    Abstract: The invention relates to an integrated circuit, electronic device, and method for assembling an integrated circuit package with at least one bottom module with a stacked die package comprising at least two dies within one single mold cap. To allow chip area reduction, the invention provides at least one memory module stacked on top of the bottom module using a ball grid array.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: September 4, 2007
    Assignee: Nokia Corporation
    Inventor: Timo Henttonen
  • Stacked package integrated circuit
    Publication number: 20060208358
    Abstract: The invention relates to an integrated circuit, electronic device, and method for assembling an integrated circuit package with at least one bottom module with a stacked die package comprising at least two dies within one single mold cap. To allow chip area reduction, the invention provides at least one memory module stacked on top of the bottom module using a ball grid array.
    Type: Application
    Filed: March 21, 2005
    Publication date: September 21, 2006
    Inventor: Timo Henttonen