Patents by Inventor Timo KAUFMANN

Timo KAUFMANN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12480785
    Abstract: A device for determining an encoder magnet rotation angle is provided, wherein the device includes an encoder magnet and a number of n greater than or equal to two magnet sensors. The magnetic field includes a plurality of plane-parallel magnetic field planes, wherein a surface normal of the plane-parallel magnetic field planes is parallel to an encoder magnet rotation axis. The magnetic field further includes a plurality of magnetic field vectors in the plane-parallel magnetic field planes. The two magnet sensors are in at least one of the plane-parallel magnetic field planes, wherein a first magnetic field vector has a first angle at a position of a first magnet sensor, and wherein a number n?1 of further ones of the magnet sensors are arranged at positions in the magnetic field whose magnetic field vectors have an angle which satisfies the equation ? i = ? i - 1 + 360 ? ° n , wherein 1<i?n.
    Type: Grant
    Filed: October 5, 2023
    Date of Patent: November 25, 2025
    Assignee: TDK—Micronas GmbH
    Inventors: Jörg Franke, Timo Kaufmann, Johannes Gutmann
  • Publication number: 20250164551
    Abstract: An electronic component has an integrated circuit, a capacitor, and several conductors that are connected by way of bonding wires with contact elements of the integrated circuit. Two conductors are connected to one another by way of a current path, in which the capacitor, a first electrically conductive layer connecting a first connector of the capacitor to the first conductor, and a second electrically conductive layer connecting a second connector of the capacitor to the second conductor are arranged. The integrated circuit has an impedance measuring device to measure the impedance between the conductors that are connected to one another by way of the current path, which device can be connected to the first conductor by means of a switch. The impedance measuring device is configured to determine the equivalent ohmic series resistance between the conductors. This enables the contact quality of the layers to be tested.
    Type: Application
    Filed: November 21, 2024
    Publication date: May 22, 2025
    Inventors: Thilo Rubehn, David Muthers, Timo Kaufmann
  • Publication number: 20250164232
    Abstract: A measurement apparatus has a magnet apparatus and a sensor apparatus, which can be rotated relative to one another about an axis of rotation. To generate magnetic field measurement signals, the sensor apparatus has a number of at least three magnetic field sensors, which are arranged offset from one another by an angle of rotation, each having an output to output a magnetic field measurement signal. The outputs are connected to a first signal path, in which a transformation device for transforming the magnetic field measurement signal into a plurality of phase-shifted transformation signals is arranged, which plurality is less than the number of the magnetic field sensors. Output connectors for the transformation signals are connected to an evaluation device for generating the angle position signal.
    Type: Application
    Filed: November 20, 2024
    Publication date: May 22, 2025
    Inventors: Nils Remmers, Timo Kaufmann
  • Publication number: 20240133714
    Abstract: A device for determining an encoder magnet rotation angle is provided, wherein the device includes an encoder magnet and a number of n greater than or equal to two magnet sensors. The magnetic field includes a plurality of plane-parallel magnetic field planes, wherein a surface normal of the plane-parallel magnetic field planes is parallel to an encoder magnet rotation axis. The magnetic field further includes a plurality of magnetic field vectors in the plane-parallel magnetic field planes. The two magnet sensors are in at least one of the plane-parallel magnetic field planes, wherein a first magnetic field vector has a first angle at a position of a first magnet sensor, and wherein a number n?1 of further ones of the magnet sensors are arranged at positions in the magnetic field whose magnetic field vectors have an angle which satisfies the equation ? i = ? i - 1 + 360 ? ° n , wherein 1<i?n.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 25, 2024
    Inventors: Jörg Franke, Timo Kaufmann, Johannes Gutmann
  • Patent number: 10816611
    Abstract: A measuring system having a magnetic device for generating a magnetic field and at least one magnetic field sensor for detecting a flux density of the magnetic field, at least in a first spatial direction. The magnetic device has a top side facing the magnetic field sensor, the magnetic field sensor is spaced apart from the top side of the magnetic device, the magnetic device has a main magnet, having two poles, with a main magnetizing direction for generating a main magnetic field and at least one secondary magnet, having two poles, with a secondary magnetization direction for generating a secondary magnetic field, the main magnet has larger dimensions than the at least one secondary magnet, the magnetic field is formed by superposition of the main magnetic field and the secondary magnetic field, the secondary magnetic field at least partially compensates the main magnetic field in the first spatial direction.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: October 27, 2020
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Joerg Franke
  • Patent number: 10605872
    Abstract: A calibration method for a Hall sensor having a Hall sensitive layer with four electrical contacts and a first field plate, wherein, at a first temperature and at a first magnetic flux density, a resistance value of the Hall sensitive layer is determined for each of at least three different field plate voltages present at the field plate, a calibration curve is produced from the at least three resistance values, a deviation value of the calibration curve is determined from a reference calibration curve, and the field plate voltage that is present at the first field plate or an operating voltage that is present at the sensitive layer is readjusted by a correction value corresponding to the deviation value.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: March 31, 2020
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Joerg Franke
  • Patent number: 10605625
    Abstract: A measuring system for determining the position of a transducer along a z-direction, having a semiconductor body having a surface, a back surface, at least one connection contact and at least one magnetic field sensor which is sensitive in the z-direction, a carrier having a front side, rear side and electrically conductive regions, a magnet for producing a magnetic field, having a first magnetic pole formed along a first surface and an axis of symmetry extending perpendicular to the first surface, wherein between at least one connection contact of the semiconductor body and at least one conductor track of the carrier, there is an electrical operative connection, the first surface of the magnet being arranged parallel to the z-direction and the axis of symmetry of the magnet being arranged perpendicular to the z-direction, the transducer having an end face facing the magnetic field sensor.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: March 31, 2020
    Assignee: TDK-Micronas GmbH
    Inventors: Joerg Franke, Timo Kaufmann
  • Patent number: 10436817
    Abstract: A test matrix adapter device having a plurality of segments arranged in a plane, the respective segments have line-shaped and column-shaped frame sections, and the segments are connected to one another in a form-fitting manner by the frame sections. Semiconductor receiving devices are arranged within the segments, that each have a plurality of first contact surfaces that are spaced apart from one another. The semiconductor receiving device are form-fittingly connected by webs to the frame sections of an assigned segment. The semiconductor receiving device has a bottom side and a base region at least partially enclosed by a frame, and an outer side. The column-shaped frame sections have projections that have second contact surfaces that are connected by conductor tracks to the first contact surfaces. The semiconductor receiving device adapted to receive a packaged semiconductor component with terminal contacts and to connect the terminal contacts to the first contact surfaces.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: October 8, 2019
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Klaus Heberle, Joerg Franke, Oliver Breitwieser
  • Patent number: 10236607
    Abstract: A contacting device having a carrier and at least one contacting unit, wherein the carrier has a bottom side and a top side, the top side of the carrier having a plurality of mutually insulated conductive tracks, the contacting unit having a plurality of contact elements that at least partially are formed of an electrically conductive material and in each case are mutually electrically insulated, each contact element along a longitudinal axis being composed of at least one fixing section and a contacting portion adjoining the fixing section, each fixing section being supported on the top side of the carrier, having a first contact surface and being positively and conductively connected to one of the conductive tracks, each contacting portion having a distance to the top side varying between zero and a maximum distance.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: March 19, 2019
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Johannes Gutmann, Mike Kunze, Klaus Heberle, Till Feger
  • Patent number: 10165686
    Abstract: An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: December 25, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Joerg Franke, Klaus Heberle, Oliver Breitwieser, Timo Kaufmann
  • Patent number: 10018684
    Abstract: A sensor device for suppressing a magnetic stray field, having a semiconductor body with a surface, formed in an x-y plane, and a back surface. Each circle half of a disk-shaped magnet has two magnetic poles and the magnet is rotatable relative to the IC housing around a z-direction. An imaginary lengthening of the axis penetrates the magnet in the center of gravity of the main extension surface of the magnet. A first pixel cell and a second pixel cell are integrated into the surface of the semiconductor body together with a circuit arrangement, and each pixel cell has a first magnetic field sensor and a second magnetic field sensor. The first pixel cell is spaced apart from the second pixel cell along a connecting line, and the first pixel cell in a projection along an imaginary lengthening of the axis is arranged within the two inner circle segments.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: July 10, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Joerg Franke
  • Patent number: 10006969
    Abstract: A sensor device is provided for suppressing a magnetic stray field, having a semiconductor body with a surface formed in an x-y plane, the x-direction and the y-direction are formed orthogonal to one another, and the sensor device has a first pixel cell and a second pixel cell integrated into the surface of the semiconductor body. A first magnetic field sensor detects a magnetic field in the x-direction and a second magnetic field sensor detects a magnetic field in the y-direction. The two pixel cells in a projection along an imaginary lengthening of the axis are arranged at an edge or next to an extension of the magnet in the x-y plane.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: June 26, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Joerg Franke
  • Publication number: 20180172780
    Abstract: A calibration method for a Hall sensor having a Hall sensitive layer with four electrical contacts and a first field plate, wherein, at a first temperature and at a first magnetic flux density, a resistance value of the Hall sensitive layer is determined for each of at least three different field plate voltages present at the field plate, a calibration curve is produced from the at least three resistance values, a deviation value of the calibration curve is determined from a reference calibration curve, and the field plate voltage that is present at the first field plate or an operating voltage that is present at the sensitive layer is readjusted by a correction value corresponding to the deviation value.
    Type: Application
    Filed: December 15, 2017
    Publication date: June 21, 2018
    Applicant: TDK-Micronas GmbH
    Inventors: Timo KAUFMANN, Joerg FRANKE
  • Patent number: 9933495
    Abstract: A sensor device for suppressing a magnetic stray field, having a semiconductor body, a first pixel cell and a second pixel cell integrated into a surface of the semiconductor body together with a circuit arrangement. Each pixel cell has a first magnetic field sensor and a second magnetic field sensor to detect a magnetic field in the x-direction and a magnetic field in the y-direction. The first pixel cell is spaced apart from the second pixel cell along a connecting line, and the substrate and the semiconductor body are disposed in the same IC package. A magnet is provided that has a planar main extension surface in the direction of an x-y plane and has a magnetization with four magnetic poles in the direction of the x-y plane. The IC package is spaced apart from the main extension surface of the magnet in the z-direction and at least partially within a ring magnet.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: April 3, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Joerg Franke, Andreas Ring
  • Publication number: 20180054008
    Abstract: A contacting device having a carrier and at least one contacting unit, wherein the carrier has a bottom side and a top side, the top side of the carrier having a plurality of mutually insulated conductive tracks, the contacting unit having a plurality of contact elements that at least partially are formed of an electrically conductive material and in each case are mutually electrically insulated, each contact element along a longitudinal axis being composed of at least one fixing section and a contacting portion adjoining the fixing section, each fixing section being supported on the top side of the carrier, having a first contact surface and being positively and conductively connected to one of the conductive tracks, each contacting portion having a distance to the top side varying between zero and a maximum distance.
    Type: Application
    Filed: August 16, 2017
    Publication date: February 22, 2018
    Applicant: TDK - Micronas GmbH
    Inventors: Timo KAUFMANN, Johannes GUTMANN, Mike KUNZE, Klaus HEBERLE, Till FEGER
  • Publication number: 20180031643
    Abstract: A measuring system having a magnetic device for generating a magnetic field and at least one magnetic field sensor for detecting a flux density of the magnetic field, at least in a first spatial direction. The magnetic device has a top side facing the magnetic field sensor, the magnetic field sensor is spaced apart from the top side of the magnetic device, the magnetic device has a main magnet, having two poles, with a main magnetizing direction for generating a main magnetic field and at least one secondary magnet, having two poles, with a secondary magnetization direction for generating a secondary magnetic field, the main magnet has larger dimensions than the at least one secondary magnet, the magnetic field is formed by superposition of the main magnetic field and the secondary magnetic field, the secondary magnetic field at least partially compensates the main magnetic field in the first spatial direction.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 1, 2018
    Applicant: TDK - Micronas GmbH
    Inventors: Timo KAUFMANN, Joerg FRANKE
  • Publication number: 20180031391
    Abstract: A measuring system for determining the position of a transducer along a z-direction, having a semiconductor body having a surface, a back surface, at least one connection contact and at least one magnetic field sensor which is sensitive in the z-direction, a carrier having a front side, rear side and electrically conductive regions, a magnet for producing a magnetic field, having a first magnetic pole formed along a first surface and an axis of symmetry extending perpendicular to the first surface, wherein between at least one connection contact of the semiconductor body and at least one conductor track of the carrier, there is an electrical operative connection, the first surface of the magnet being arranged parallel to the z-direction and the axis of symmetry of the magnet being arranged perpendicular to the z-direction, the transducer having an end face facing the magnetic field sensor.
    Type: Application
    Filed: July 31, 2017
    Publication date: February 1, 2018
    Applicant: TDK - Micronas GmbH
    Inventors: Joerg FRANKE, Timo KAUFMANN
  • Patent number: 9880024
    Abstract: A measurement device for determining an angular position, having a magnet device and a sensor device that are rotatable relative to one another. The magnet device has a first north pole face of a first magnetic north pole and a first south pole face of a first magnetic south pole. The magnet device has a second north pole face of a second magnetic north pole and a second south pole face of a second magnetic south pole. The sensor device is located in a region between the first north pole face and the first south pole face and between the second north pole face and the second south pole face. The sensor device has a first magnetic field sensor and a second magnetic field sensor. The first magnetic field sensor and the second magnetic field sensor are spaced apart from one another for ascertaining a magnetic field difference.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: January 30, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Joerg Franke
  • Patent number: 9780470
    Abstract: A contact device system having a plate-shaped carrier and at least five accommodating areas are disposed on a bottom side of the pressing unit, at least five accommodating areas and at least five contact area pairs are disposed on a top side of the carrier. The contact area pairs each have a first and second electrically conductive contact area, and in each case the first contact area is spaced apart from the second contact area and insulated electrically therefrom. The first and second contact areas have a functional electrical connection to an evaluation circuit via a trace section. The carrier has a plurality of accommodating areas for a packaged electronic component, that each have one of the at least five contact area pairs. The electronic components have at least two terminal contacts, whereby after accommodation of the packaged electronic components, the terminal contacts of the particular component are pressed down.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: October 3, 2017
    Assignee: TDK-Micronas GmbH
    Inventors: Johannes Gutmann, Timo Kaufmann, Klaus Heberle, Mike Kunze, Till Feger, Georg Sammel
  • Publication number: 20170227578
    Abstract: A test matrix adapter device having a plurality of segments arranged in a plane, the respective segments have line-shaped and column-shaped frame sections, and the segments are connected to one another in a form-fitting manner by the frame sections. Semiconductor receiving devices are arranged within the segments, that each have a plurality of first contact surfaces that are spaced apart from one another. The semiconductor receiving device are form-fittingly connected by webs to the frame sections of an assigned segment. The semiconductor receiving device has a bottom side and a base region at least partially enclosed by a frame, and an outer side. The column-shaped frame sections have projections that have second contact surfaces that are connected by conductor tracks to the first contact surfaces. The semiconductor receiving device adapted to receive a packaged semiconductor component with terminal contacts and to connect the terminal contacts to the first contact surfaces.
    Type: Application
    Filed: February 10, 2017
    Publication date: August 10, 2017
    Applicant: TDK-Micronas GmbH
    Inventors: Timo KAUFMANN, Klaus HEBERLE, Joerg FRANKE, Oliver BREITWIESER