Abstract: In an embodiment, a modular RF shielding is disclosed. According to an embodiment, a device is disclosed comprising: at least one radio frequency shielding block including: an electrically conductive wall configured to radio frequency shielding; an electrically conductive portion of a ceiling, wherein the portion of the ceiling is connected to the wall; at least one support element, or the shape of the modular block itself, is extending transversely from the wall and configured to uphold the wall, wherein the support element is configured to rest against a portion of a printed circuit board and a length of the support element is shorter than a length of the block; wherein the wall is configured next to an electrical component of the printed circuit board and wherein the electrical component is configured at least partly beneath the portion of the ceiling. Other embodiments relate to a mobile device and a manufacturing method for the modular RF shielding.

Abstract: In an embodiment, a modular RF shielding is disclosed. According to an embodiment, a device is disclosed comprising: at least one radio frequency shielding block including: an electrically conductive wall configured to radio frequency shielding; an electrically conductive portion of a ceiling, wherein the portion of the ceiling is connected to the wall; at least one support element, or the shape of the modular block itself, is extending transversely from the wall and configured to uphold the wall, wherein the support element is configured to rest against a portion of a printed circuit board and a length of the support element is shorter than a length of the block; wherein the wall is configured next to an electrical component of the printed circuit board and wherein the electrical component is configured at least partly beneath the portion of the ceiling. Other embodiments relate to a mobile device and a manufacturing method for the modular RF shielding.

Abstract: The invention relates to a method for monitoring the paste printing process in the setting and soldering of a circuit board. In the paste printing process, solder paste (5) is spread on the circuit board (4) at the surface mounted devices to be set or at the corresponding solder pads (7) of the connecting pins. According to the invention, at least one paste test pattern (9) is arranged on the circuit board (4), which test pattern consists of a number of test elements (91, 92, 93, 94), shaped like geometrical plane figures on the surface of the circuit board, and which test elements have varying degrees of difficulty in view of the printing process.