Abstract: A method for heating a substrate (12) and/or an electronic component (14) arranged on the substrate (12) for desoldering and/or soldering the component (14) by a soldering device (10) with an energy dissipation (E), a device position (P), and/or a device acceleration (a). The soldering device (10) heats a soldering point (20) on the substrate (12) and/or on the component (14) by heat conduction, heat radiation, and/or heat convection, and has a first energy dissipation (E), a first device position (Px,y,z), and/or a first device acceleration (ax,y,z). The soldering device (10) moves towards and/or away from the soldering point (20), has a second energy dissipation (E), a second device position (Px,y,z), and/or a second device acceleration (ax,y,z). The state of the soldering point (20), the substrate (12), and/or the component (14) depends on time series of the energy dissipation (E), the device position (Px,y,z), and/or the device acceleration (ax,y,z).

Abstract: A network and a method for operating a network is provided. The network includes one or more soldering systems provided in the network, and the soldering systems each include at least one soldering apparatus for soldering electronic components, a user interface for outputting target-soldering-information to a user; and a way for determining actual soldering information. The network includes at least one input device for inputting and/or specifying work information, and a control unit which is designed to identify soldering systems provided in the network; create soldering tasks with target-soldering-information from the work information depending on the identified soldering systems and assign the tasks to the relevant soldering system; and process the actual soldering information of the relevant soldering system with the associated target-soldering-information of the relevant soldering system.