Patents by Inventor Timothty D. SULLIVAN

Timothty D. SULLIVAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES
    Publication number: 20100167522
    Abstract: Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The method includes forming a plurality of trenches in a dielectric layer extending to an underlying metal layer. The method further includes depositing metal in the plurality of trenches to form discrete metal line islands in contact with the underlying metal layer. The method also includes forming a solder bump in electrical connection to the plurality of metal line islands.
    Type: Application
    Filed: December 29, 2008
    Publication date: July 1, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy H. DAUBENSPECK, Jeffrey P. GAMBINO, Christopher D. MUZZY, Wolfgang SAUTER, Timothty D. SULLIVAN