Abstract: The present disclosure provides an ultrasound device including thermal dissipation features. The ultrasound device is an ultrasound probe in some situations and includes thermal dissipation features allowing for increased runtime at higher power consumption rates. The thermal dissipation features include an interposer with thermal vias, a heat spreader, a heat sink, a single piece probe housing, and a chassis, or various combinations of such features.

Abstract: A removable cable connector engages with an electronic device such that the removable cable connector removably yet securely attaches to the electronic device. In some embodiments, the electronic device includes a plate configured to guide an electronic plug of the removable cable connector toward an electronic receptacle of the electronic device. The plate may be further configured to include one or more locators for holding the electronic receptacle of the electronic device in place. The removable cable connector may include a molded housing formed using a two-shot overmolding process to form a first overmolded strain relief portion and a second overmolded strain relief portion which cover fasteners that fasten a face plate to the connector.

Abstract: An energy production device may include a core and a heat exchanger positioned over the core. The core may include one or more fuel rods. The core may further include a heat transmission fluid configured to flow through natural convection upwards through the one or more fuel rods and collect heat therefrom. The core may also include a reaction control device including a neutron-absorbing material. The heat exchanger may be configured to receive the heat transmission fluid and transfer the heat to an energy harnessing device positioned on an opposite side of the heat exchanger from the core.

Abstract: A removable cable connector engages with an electronic device such that the removable cable connector removably yet securely attaches to the electronic device. In some embodiments, the electronic device includes a plate configured to guide an electronic plug of the removable cable connector toward an electronic receptacle of the electronic device. The plate may be further configured to include one or more locators for holding the electronic receptacle of the electronic device in place. The removable cable connector may include a molded housing formed using a two-shot overmolding process to form a first overmolded strain relief portion and a second overmolded strain relief portion which cover fasteners that fasten a face plate to the connector.

Abstract: The invention includes methods of forming a metallic coating on a substrate which contains silicon. A metallic glass layer is formed over a silicon surface of the substrate. The invention includes methods of protecting a silicon substrate. The substrate is provided within a deposition chamber along with a deposition target. Material from the deposition target is deposited over at least a portion of the silicon substrate to form a protective layer or structure which contains metallic glass. The metallic glass comprises iron and one or more of B, Si, P and C. The invention includes structures which have a substrate containing silicon and a metallic layer over the substrate. The metallic layer contains less than or equal to about 2 weight % carbon and has a hardness of at least 9.2 GPa. The metallic layer can have an amorphous microstructure or can be devitrified to have a nanocrystalline microstructure.

Abstract: The invention includes methods of forming a metallic coating on a substrate which contains silicon. A metallic glass layer is formed over a silicon surface of the substrate. The invention includes methods of protecting a silicon substrate. The substrate is provided within a deposition chamber along with a deposition target. Material from the deposition target is deposited over at least a portion of the silicon substrate to form a protective layer or structure which contains metallic glass. The metallic glass comprises iron and one or more of B, Si, P and C. The invention includes structures which have a substrate containing silicon and a metallic layer over the substrate. The metallic layer contains less than or equal to about 2 weight % carbon and has a hardness of at least 9.2 GPa. The metallic layer can have an amorphous microstructure or can be devitrified to have a nanocrystalline microstructure.

Abstract: The invention encompasses methods of utilizing atomization, methods for forming magnet powders, methods for forming magnets, and methods for forming bonded magnets. The invention further encompasses methods for simulating atomization conditions. In one aspect, the invention includes an atomization method for forming a magnet powder comprising: a) forming a melt comprising R.sub.2.1 Q.sub.13.9 B.sub.