Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.

Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.

Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.

Abstract: A cooling system (11) is provided for electrical components (10, 90) in which passageways (21) are inserted in non-magnetic cores of the electrical components, and in which the passageways (21) provide both inflow and outflow of a cooling medium. The passageways (21) can be formed by drilling holes in a core of an electrical component or by mounting closed-end tubes (16–19) on a base plate-cooling manifold (20) or can be part of a conduit assembly (70). The tubes (16–19, 71) are split-flow closed-end tubes inserted from one end of the electrical component (10, 90). The tubes and passageways (16–19, 21, 71) may be partitioned into two halves or into two concentric portions. O-ring seals (28) are provided around the base of the tubes to seal the areas where the passageways communicate with hollow portions of base plates for supplying the cooling medium.

Abstract: A cooling system is provided for electrical components in which cooling assemblies (11, 45) are inserted in non-magnetic cores of the electrical components, and in which tubes provide both inflow and outflow of a cooling medium. The non-magnetic cores may be bobbins (30) for an inductor assembly or the core of a capacitor (40). The tubes may form a loop (11) in more than one plane to prevent inducing current in a single turn, or they may be split-flow closed-end tubes (45) inserted from one end of the electrical component. The bobbin cores (31) are also constructed with a non-conductive portion to prevent inducing a current in a single turn of a conductor.

Abstract: A cooling system (11) is provided for electrical components (10, 90) in which passageways (21) are inserted in non-magnetic cores of the electrical components, and in which the passageways (21) provide both inflow and outflow of a cooling medium. The passageways (21) can be formed by drilling holes in a core of an electrical component or by mounting closed-end tubes (16-19) on a base plate-cooling manifold (20) or can be part of a conduit assembly (70). The tubes (16-19, 71) are split-flow closed-end tubes inserted from one end of the electrical component (10, 90). The tubes and passageways (16-19, 21, 71) may be partitioned into two halves or into two concentric portions. O-ring seals (28) are provided around the base of the tubes to seal the areas where the passageways communicate with hollow portions of base plates for supplying the cooling medium.

Abstract: A cooling system is provided for electrical components in which cooling assemblies (11, 45) are inserted in non-magnetic cores of the electrical components, and in which tubes provide both inflow and outflow of a cooling medium. The non-magnetic cores may be bobbins (30) for an inductor assembly or the core of a capacitor (40). The tubes may form a loop (11) in more than one plane to prevent inducing current in a single turn, or they may be split-flow closed-end tubes (45) inserted from one end of the electrical component. The bobbin cores (31) are also constructed with a non-conductive portion to prevent inducing a current in a single turn of a conductor.

Abstract: A multi-layer power backplane system is disclosed for use with various power electronic and other systems. The power backplane includes multiple mechanical, conductor and isolation layers which serve to route power to and from various components. The layers are isolated from one another by support/isolation panels which may receive conductors used to route power. Data signals may also be routed through the system. The system accommodates fluid cooling of the electronic components by an additional layer of conduit support and isolation. The overall system provides a high degree of flexibility and modularity in defining a power backplane for a wide range of circuitry and components which may be mounted thereto once the power backplane is designed and assembled.

Abstract: A multi-layer power backplane system is disclosed for use with various power electronic and other systems. The power backplane includes multiple mechanical, conductor and isolation layers which serve to route power to and from various components. The layers are isolated from one another by support/isolation panels which may receive conductors used to route power. Data signals may also be routed through the system. The system accommodates fluid cooling of the electronic components by an additional layer of conduit support and isolation. The overall system provides a high degree of flexibility and modularity in defining a power backplane for a wide range of circuitry and components which may be mounted thereto once the power backplane is designed and assembled.

Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.