Abstract: A redundant heat sink module can include a first independent coolant pathway and a second independent coolant pathway. The first independent coolant pathway can include a first inlet chamber, a first outlet chamber, and a first plurality of orifices extending from the first inlet chamber to the first outlet chamber and providing a first plurality of impinging jet streams of coolant against a first region of a surface to be cooled when pressurized coolant is provided to the first inlet chamber. The second independent coolant pathway can include a second inlet chamber, a second outlet chamber, and a second plurality of orifices extending from the second inlet chamber to the second outlet chamber and providing a second plurality of impinging jet streams of coolant against a second region of the surface to be cooled when pressurized coolant is provided to the second inlet chamber.

Abstract: A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the apparatus. The nozzle plate includes a plurality of flow paths through which the cooling fluid passes from the inlet volume to the outlet volume. The flow paths cause the fluid to exit the nozzle plate as transversely expanding fluid jets.

Abstract: A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the apparatus. The nozzle plate includes a plurality of flow paths through which the cooling fluid passes from the inlet volume to the outlet volume. The flow paths cause the fluid to exit the nozzle plate as transversely expanding fluid jets.

Abstract: A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the apparatus. The nozzle plate includes a plurality of flow paths through which the cooling fluid passes from the inlet volume to the outlet volume. The flow paths cause the fluid to exit the nozzle plate as transversely expanding fluid jets.

Abstract: A redundant heat sink module can include a first independent coolant pathway and a second independent coolant pathway. The first independent coolant pathway can include a first inlet chamber, a first outlet chamber, and a first plurality of orifices extending from the first inlet chamber to the first outlet chamber and providing a first plurality of impinging jet streams of coolant against a first region of a surface to be cooled when pressurized coolant is provided to the first inlet chamber. The second independent coolant pathway can include a second inlet chamber, a second outlet chamber, and a second plurality of orifices extending from the second inlet chamber to the second outlet chamber and providing a second plurality of impinging jet streams of coolant against a second region of the surface to be cooled when pressurized coolant is provided to the second inlet chamber.

Abstract: A fluid distribution unit for a two-phase cooling system can include a reservoir configured to receive a two-phase flow of dielectric coolant. A first pump can be fluidly connected to a supply line extending from the reservoir. A heat rejection loop can be fluidly connected to the reservoir. The heat rejection loop can include a heat exchanger and a second pump. The second pump can be configured to circulate a flow of single-phase liquid coolant from the reservoir, through the heat exchanger, and back to the reservoir.

Abstract: Disclosed are methods and apparatuses for cooling a work piece surface using two-phase impingement, such as direct jet impingement. Preferred method include flowing a coolant through a chamber comprising a surface to be cooled by projecting a jet stream of coolant against the surface while maintaining pressure in the chamber to permit at least a portion of coolant contacting the surface to boil. Preferred apparatuses include a chamber comprising the surface and tubular nozzles configured to project a stream of coolant against the surface, a pump for forcing coolant through the tubular nozzles, a pressurizer for maintaining an appropriate pressure in the chamber, and a heat exchanger for cooling the coolant exiting the chamber. The apparatuses may further include a pressure regulator for detecting changes in temperature of the coolant exiting the chamber and communicating with the pressurizer to adjust the maintained pressure accordingly.

Abstract: A redundant heat sink module can include a first independent coolant pathway and a second independent coolant pathway. The first independent coolant pathway can include a first inlet chamber, a first outlet chamber, and a first plurality of orifices extending from the first inlet chamber to the first outlet chamber and providing a first plurality of impinging jet streams of coolant against a first region of a surface to be cooled when pressurized coolant is provided to the first inlet chamber. The second independent coolant pathway can include a second inlet chamber, a second outlet chamber, and a second plurality of orifices extending from the second inlet chamber to the second outlet chamber and providing a second plurality of impinging jet streams of coolant against a second region of the surface to be cooled when pressurized coolant is provided to the second inlet chamber.

Abstract: A method of cooling two or more heat-providing surfaces using a cooling apparatus having two or more fluidly connected heat sink modules in a series configuration can include providing a flow of single-phase liquid coolant to a first heat sink module mounted on a first heat-providing surface. The method can include projecting the flow of single-phase liquid coolant against the first heat-providing surface within the first heat sink module and causing phase change of a first portion of the liquid coolant and thereby forming two-phase bubbly flow with a first quality. The method can include transporting the two-phase bubbly flow to a second heat sink module and projecting the two-phase bubbly flow against a second heat-providing surface within the second heat sink module and causing phase change of a second portion of the coolant and formation of two-phase bubbly flow with a second quality greater than the first quality.

Abstract: A heat exchanger can include a stacked array of interconnected fluid transfer members. The stacked array of interconnected fluid transfer members can include a first fluid transfer member, a second fluid transfer member, a third fluid transfer member, and a fourth fluid transfer member. The first fluid transfer member can include a liquid passageway extending lengthwise though the first fluid transfer member and a set of helical fins extending outwardly from an outer surface of the first fluid transfer member and rotating along a length of the first fluid transfer member. The stacked array of interconnected fluid transfer members can form a jointless structure.

Abstract: A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.

Abstract: A method of absorbing heat from two or more devices can employ a two-phase cooling apparatus that pumps low-pressure coolant through two or more fluidly-connected and series-connected heat sink modules. A flow of subcooled single-phase liquid coolant can be provided to an inlet of a first heat sink module in thermal communication with a first device. Within the first heat sink module, the flow of subcooled single-phase liquid coolant can absorb a first amount of heat from the first device as sensible heat. The flow of subcooled single-phase liquid coolant can be transported from an outlet of the first heat sink module to an inlet of a second heat sink module. Within the second heat sink module, the flow of subcooled single-phase liquid coolant can absorb a second amount of heat from the second device partially as sensible heat and partially as latent heat and thereby transform to two-phase bubbly flow.

Abstract: A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, two-phase dielectric coolant. The first bypass can include a first pressure regulator configured to regulate a first bypass flow of coolant through the first bypass. The second bypass can include a second pressure regulator configured to regulate a second bypass flow of coolant through the second bypass.

Abstract: A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface. The heat sink module can include a dividing member disposed between the inlet chamber and the outlet chamber. The dividing member can include a first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.

Abstract: A method of operating a cooling apparatus is described that allows flexible cooling lines connecting an inlet manifold to an outlet manifold to be safely added or removed during operation of the cooling apparatus without causing unstable two-phase flow. The method can include providing a cooling apparatus having an inlet manifold, an outlet manifold, and a bypass extending from the inlet manifold to the outlet manifold. Each manifold can include a plurality of connection ports, such as quick-connect couplers, to accommodate adding and removing cooling lines between the inlet manifold and the outlet manifold. The method can include providing a flow rate of single-phase liquid coolant to the inlet manifold and setting a pressure regulator in the bypass to provide a certain flow rate through the bypass. The flow rate through the bypass can be determined as a function of an average flow rate through each of the cooling lines.

Abstract: A multi-chamber heat sink module can provide fluid cooling of one or more heat providing surfaces. The module can include a first plurality of orifices fluidly connecting a first inlet chamber to a first outlet chamber. The first outlet chamber can be configured to be bounded by a portion of a heat providing surface. The first plurality of orifices can be configured to deliver a first plurality of jet streams of coolant into the first outlet chamber and against the portion of the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the first inlet chamber. The heat sink module can include a second inlet chamber fluidly connected to a first outlet passage and a second plurality of orifices fluidly connecting the second inlet chamber to a second outlet chamber.

Abstract: A hot-swappable server can be adapted to blindly mate to a manifold assembly of a cooling system. The server can include a chassis with a circuit board positioned within the chassis and a first processor electrically connected to the circuit board. The server can include a cooling line assembly with an inlet fitting, an outlet fitting, and a heat sink module fluidly connected between the inlet and outlet fittings. The first heat sink module can be in thermal communication with the first processor. The inlet and outlet fittings can be mounted to the chassis proximate a rear side of the chassis. The inlet and outlet fittings can be blind-mate fittings. Coolant flowing through the cooling line assembly can flow in through the inlet fitting, through the first heat sink module where it absorbs heat from the first processor, and out through the outlet fitting.

Abstract: A fluid distribution unit for a two-phase cooling system can include a reservoir configured to receive a two-phase flow of dielectric coolant. A first pump can be fluidly connected to a supply line extending from the reservoir. A heat rejection loop can be fluidly connected to the reservoir. The heat rejection loop can include a heat exchanger and a second pump. The second pump can be configured to circulate a flow of single-phase liquid coolant from the reservoir, through the heat exchanger, and back to the reservoir.

Abstract: A flexible cooling line assembly, when fluidly connected to a two-phase cooling apparatus, can provide device-level cooling to one or more devices. The assembly can include a first section of flexible, low-pressure tubing fluidly connected to an inlet port of a heat sink module. The heat sink module can include an inlet chamber fluidly connected to the inlet port and a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber. The outlet chamber can be fluidly connected to an outlet port of the module, and a second section of flexible, low-pressure tubing can be fluidly connected to the outlet port. The plurality of orifices can deliver a plurality of jet streams of coolant into the outlet chamber and against a heat providing surface when the first heat sink module is mounted to the heat providing surface and when pressurized coolant is delivered to the inlet chamber.

Abstract: A heat exchanger can include a stacked array of interconnected fluid transfer members. The stacked array of interconnected fluid transfer members can include a first fluid transfer member, a second fluid transfer member, a third fluid transfer member, and a fourth fluid transfer member. The first fluid transfer member can include a liquid passageway extending lengthwise though the first fluid transfer member and a set of helical fins extending outwardly from an outer surface of the first fluid transfer member and rotating along a length of the first fluid transfer member. The stacked array of interconnected fluid transfer members can form a jointless structure.