Abstract: A novel inspection system for inspecting an article of manufacture, such as a printed circuit board, is disclosed, where the system includes a strobed illuminator adapted to project light through a reticle so as to project a pattern of light onto an area of the printed circuit board. A board transport responsively positions the board to at least two distinct positions, where each position corresponding to a different phase of the projected light. Also included is a detector adapted to acquire at least two images of the area, each image corresponding to one of the at least two different phases. An encoder monitors the movement of the board and outputs a position output, and a processor connected to the encoder, the board transport, the illuminator and the detector controlledly energizes the illuminator to expose the area as a function of the position output, the processor co-siting the at least two images and constructing a height map image with the co-sited images.

Abstract: A method of calibrating a pick and place machine having an on-head linescan sensor is disclosed. The calibration includes obtaining z-axis height information of one or more nozzle tips via focus metric methods, including a Fourier transform method and a normalized correlation method. Additionally, other physical characteristics such as linear detector tilt, horizontal scale factor, and vertical scale factor are measured and compensated for in the process of placing the component. Nozzle runout, another physical characteristic, is also measured by a sinusoidal curve fit method, and the resulting Z-height calibration data is used to later place the component.

Abstract: An optical device is provided which includes a plurality of optical modules. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to a substrate. A plurality of optical modules mount on the substrate to form the optical device.

Abstract: An optical module for use in an optical device is provided. The module includes an optical component and relative reference mount. The optical component is fixed spacially relative to a registration feature. The registration feature is configured to couple to a fixed reference mount.

Abstract: A method of calibrating a pick and place machine having an on-head linescan sensor is disclosed. The calibration includes obtaining z-axis height information of one or more nozzle tips via focus metric methods, including a Fourier transform method and a normalized correlation method. Additionally, other physical characteristics such as linear detector tilt, horizontal scale factor, and vertical scale factor are measured and compensated for in the process of placing the component. Nozzle runout, another physical characteristic, is also measured by a sinusoidal curve fit method, and the resulting Z-height calibration data is used to later place the component.

Abstract: A pick and place machine, and its imaging system are disclosed. The imaging system is movable with a head of the pick and place machine and includes a linear detector which is adapted to move proximate the component to thereby scan the component. The imaging system provides an indication of feature height on a component held by the pick and place machine. The height is based upon the intensity of a plurality of focused images. A method for sensing feature height of an object on a component as well as the coplanarity of objects held by a pick and place machine is also provided.

Abstract: An optical alignment system is provided for aligning an optical module of the type which is suitable for use in an optical device. The system includes a reference base having a registration feature that aligns with a registration feature of the optical module. An optical sensor senses an optical characteristic of the optical element and optical element manipulator moves the optical element relative to the registration features of the optical module. A controller operates the optical element manipulator.

Abstract: Methods and an apparatus are disclosed for providing enhanced vibration immunity in a solder paste inspection system, although they are usable in any number of industries that require rapid acquisition of several images. The method includes capturing at least three images on a frame transfer CCD array before any data is sequentially read from the array. The present method is extendable to a larger number of images. Additionally, the masked memory area can be larger than the image area of the frame transfer CCD array.

Abstract: An optical module for use in an optical device is provided. The module includes an optical component and relative reference mount. The optical component is fixed spacially relative to a registration feature. The registration feature is configured to couple to a fixed reference mount.

Abstract: An optical device is provided which includes a plurality of optical modules. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to a substrate. A plurality of optical modules mount on the substrate to form the optical device.

Abstract: A pick and place machine is disclosed which includes an on-head linescan sensor, and at least one additional optical sensor. The at least one additional sensor can be an off-head linescan sensor, an off-head or on-head 2D camera, an on-head shadow (e.g. one which shadows or images the profile of a component onto a detector, such as a LaserAlign®) sensor, an off-head or on-head coplanarity sensor, or an on-head or off-head fiducial camera. The additional optical sensor is disposed to provide essential placement information in the form of orientation information or inspection information. Combinations of the aforementioned additional sensor can also be used in embodiments of the present invention of the pick-and-place machine. The present invention is particularly useful with multi-head component placement machines, although it is usable with single head machines as well.

Abstract: A method of calibrating a pick and place machine having an on-head linescan sensor is disclosed. The calibration includes obtaining z-axis height information of one or more nozzle tips via focus metric methods, including a Fourier transform method and a normalized correlation method. Additionally, other physical characteristics such as linear detector tilt, horizontal scale factor, and vertical scale factor are measured and compensated for in the process of placing the component. Nozzle runout, another physical characteristic, is also measured by a sinusoidal curve fit method, and the resulting Z-height calibration data is used to later place the component.

Abstract: An optical module for use in an optical device is provided. The module includes an optical component and relative reference mount. The optical component is fixed spacially relative to a registration feature. The registration feature is configured to couple to a fixed reference mount. Electrical signal routing is provide to electrically couple to the optical component.

Abstract: A method and apparatus for automatically assembling an optical device is provided. Prealigned optical modules are mounted by a pick and place machine onto a fixed reference.

Abstract: An optical module for use in an optical device is provided which includes an optical component. The optical component is bonded to a relative reference mount which can be attached to couple to a fixed reference mount. The bond is formed by solder.

Abstract: An optical module for use in an optical device is provided which includes an optical component. The optical component is bonded to a relative reference mount which can be attached to couple to a fixed reference mount. The bond is formed by solder.

Abstract: An optical alignment system is provided for aligning an optical module of the type which is suitable for use in an optical device. The system includes a reference base having a registration feature that aligns with a registration feature of the optical module. An optical sensor senses an optical characteristic of the optical element and optical element manipulator moves the optical element relative to the registration features of the optical module. A controller operates the optical element manipulator.

Abstract: An optical device includes a fixed reference. A first optical module has a first optical component prealigned with respect to a reference feature, the first optical module is subsequently mounted to a first predetermined location on the fixed reference. A second optical module has second optical component prealigned with respect to a reference feature, the second optical module mounted to a second predetermined location on the fixed reference.

Abstract: An optical module for use in an optical device is provided. The module includes an optical component and relative reference mount. The optical component is fixed spacially relative to a registration feature. The registration feature is configured to couple to a fixed reference mount.

Abstract: A high speed high precision laser based alignment sensor system for use on surface mount component placement machines. A laser system is utilized to correctly align and position component parts which range between 0.02 inches and 2.0 inches in size. The laser sensor system consists of a laser light source which is passed through a collimating lens and then through an aperture to create a stripe of collimated laser light which is focused past the component being aligned to strike a multi-element CCD sensor array. The sensor system is mounted directly on the carrying mechanism for the surface mount component placement machine. During transit of the component between the bin of components is to be placed, the component is rotated and the shadow which falls on the detector array is monitored.