Abstract: A fuel system for an internal combustion engine includes an electric fuel pump; a conduit which defines a flow path through which fuel flows from the electric fuel pump to the internal combustion engine; a fuel pump control module with electronics which drive the electric fuel pump, the fuel pump control module being disposed within a compartment defined by a wall; and a heat sink in thermal contact with the fuel pump control module and extending out of the compartment through an aperture of the wall and into the flow path such that the heat sink is sealed to the wall, thereby preventing fluid communication through the aperture.

Abstract: A fuel system for an internal combustion engine includes an electric fuel pump; a conduit which defines a flow path through which fuel flows from the electric fuel pump to the internal combustion engine; a fuel pump control module with electronics which drive the electric fuel pump, the fuel pump control module being disposed within a compartment defined by a wall; and a heat sink in thermal contact with the fuel pump control module and extending out of the compartment through an aperture of the wall and into the flow path such that the heat sink is sealed to the wall, thereby preventing fluid communication through the aperture.

Abstract: An engine control module having an environmentally-sealed housing includes a housing-mounted air pressure sensor for providing a reliable measure of atmospheric air pressure to a control circuit mounted within the housing. The sensor is mounted on an inboard face of the housing, and includes a sensor element, a body portion and a riser portion. The sensor element is mounted in the body portion, and the riser portion protrudes through an opening in the housing to couple the sensor element to atmospheric pressure outside the housing. The body portion is sealingly secured to the inboard face of the housing, and a set of conductor pins molded into the body portion extend inward to engage a circuit board enclosed by the housing, and thereby directly couple the sensor element to the ECM's control circuit. The top of the riser portion is capped by a splash-proof lid to prevent water intrusion.

Abstract: An engine control module having an environmentally-sealed housing includes a housing-mounted air pressure sensor for providing a reliable measure of atmospheric air pressure to a control circuit mounted within the housing. The sensor is mounted on an inboard face of the housing, and includes a sensor element, a body portion and a riser portion. The sensor element is mounted in the body portion, and the riser portion protrudes through an opening in the housing to couple the sensor element to atmospheric pressure outside the housing. The body portion is sealingly secured to the inboard face of the housing, and a set of conductor pins molded into the body portion extend inward to engage a circuit board enclosed by the housing, and thereby directly couple the sensor element to the ECM's control circuit. The top of the riser portion is capped by a splash-proof lid to prevent water intrusion.

Abstract: A dual pressure sensor apparatus configured for attachment to a manifold includes a molded plastic housing with a body portion featuring an upper cavity, a measurement port, and a lower cavity closed by the manifold. First and second pressure sensor modules are mounted in first and second wells formed in the upper cavity, and electrically coupled to a set of leadframe terminals disposed in the upper cavity. An opening in the first well couples the first pressure sensor module to the measurement port, and an opening in the second well couples the second pressure sensor module to the lower cavity. The measurement port sealingly extends through an opening in the manifold so that the first pressure sensor module measures pressure in the manifold, and the body portion walls bounding the lower cavity are notched so that the second pressure sensor module measures atmospheric or barometric pressure outside the manifold.

Abstract: A dual pressure sensor apparatus configured for attachment to a manifold includes a molded plastic housing with a body portion featuring an upper cavity, a measurement port, and a lower cavity closed by the manifold. First and second pressure sensor modules are mounted in first and second wells formed in the upper cavity, and electrically coupled to a set of leadframe terminals disposed in the upper cavity. An opening in the first well couples the first pressure sensor module to the measurement port, and an opening in the second well couples the second pressure sensor module to the lower cavity. The measurement port sealingly extends through an opening in the manifold so that the first pressure sensor module measures pressure in the manifold, and the body portion walls bounding the lower cavity are notched so that the second pressure sensor module measures atmospheric or barometric pressure outside the manifold.

Abstract: Silicon-based high pressure sensor modules are manufactured in an array arrangement, incorporating a low temperature cofired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. Bossed containers filled with oil are mounted on the substrate in an array. These bossed containers house the sensor cells which are composed of a sensor handle wafer and a diaphragm. The top surface of these bossed containers are flexible and deflect under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensors can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.

Abstract: A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.

Abstract: Silicon-based high pressure sensor modules are manufactured in an array arrangement, incorporating a low temperature cofired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. Bossed containers filled with oil are mounted on the substrate in an array. These bossed containers house the sensor cells which are composed of a sensor handle wafer and a diaphragm. The top surface of these bossed containers are flexible and deflect under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensors can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.

Abstract: A silicon-based high pressure sensor module incorporates a low temperature cofired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. A bossed container filled with oil is mounted on the substrate and houses a sensor cell. The top surface of the bossed container is flexible and deflects under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensor can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.

Abstract: A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.

Abstract: An infrared temperature sensing device is provided for sensing temperature of a target object. The sensing device includes a semiconductor substrate, a thermopile infrared sensor mounted to the substrate for sensing temperature of a remote target object, and temperature sensing circuitry mounted to the substrate. The temperature sensing circuitry generates a temperature dependent signal substantially linearly related to ambient temperature of the substrate. The sensing device further includes summing circuitry for generating a signal indicative of infrared sensed temperature as a function of the ambient temperature.

Abstract: A process of forming a capacitive audio transducer, preferably having an all-silicon monolithic construction that includes capacitive plates defined by doped single-crystal silicon layers. The capacitive plates are defined by etching the single-crystal silicon layers, and the capacitive gap therebetween is accurately established by wafer bonding, yielding a transducer that can be produced by high-volume manufacturing practices.

Abstract: A silicon-based high pressure sensor module incorporates a low temperature cofired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. A bossed container filled with oil is mounted on the substrate and houses a sensor cell. The top surface of the bossed container is flexible and deflects under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensor can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.

Abstract: A technique for manufacturing an integrated pressure sensor includes a number of steps. Initially, a substrate with conductive electrical traces located on first and second sides of the substrate is provided. A plurality of compensation circuits are positioned in an array on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate. A plurality of pressure sensors are positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate. Each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs. The substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits provides temperature compensation for an associated one of the sensors.

Abstract: A technique for manufacturing an integrated pressure sensor includes a number of steps. Initially, a substrate with conductive electrical traces located on first and second sides of the substrate is provided. A plurality of compensation circuits are positioned in an array on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate. A plurality of pressure sensors are positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate. Each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs. The substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits provides temperature compensation for an associated one of the sensors.

Abstract: A process of forming a capacitive audio transducer, preferably having an all-silicon monolithic construction that includes capacitive plates defined by doped single-crystal silicon layers. The capacitive plates are defined by etching the single-crystal silicon layers, and the capacitive gap therebetween is accurately established by wafer bonding, yielding a transducer that can be produced by high-volume manufacturing practices.

Abstract: A process of forming a capacitive audio transducer, preferably having an all-silicon monolithic construction that includes capacitive plates defined by doped single-crystal silicon layers. The capacitive plates are defined by etching the single-crystal silicon layers, and the capacitive gap therebetween is accurately established by wafer bonding, yielding a transducer that can be produced by high-volume manufacturing practices.

Abstract: An integrated sensor comprising a thermopile transducer and signal processing circuitry that are combined on a single semiconductor substrate, such that the transducer output signal is sampled in close vicinity by the processing circuitry. The sensor comprises a frame formed of a semiconductor material that is not heavily doped, and with which a diaphragm is supported. The diaphragm has a first surface for receiving thermal (e.g., infrared) radiation, and comprises multiple layers that include a sensing layer containing at least a pair of interlaced thermopiles. Each thermopile comprises a sequence of thermocouples, each thermocouple comprising dissimilar electrically-resistive materials that define hot junctions located on the diaphragm and cold junctions located on the frame. The signal processing circuitry is located on the frame and electrically interconnected with the thermopiles.

Abstract: An integrated sensor comprising a thermopile transducer and signal processing circuitry that are combined on a single semiconductor substrate, such that the transducer output signal is sampled in close vicinity by the processing circuitry. The sensor comprises a frame formed of a semiconductor material that is not heavily doped, and with which a diaphragm is supported. The diaphragm has a first surface for receiving thermal (e.g., infrared) radiation, and comprises multiple layers that include a sensing layer containing at least a pair of interlaced thermopiles. Each thermopile comprises a sequence of thermocouples, each thermocouple comprising dissimilar electrically-resistive materials that define hot junctions located on the diaphragm and cold junctions located on the frame. The signal processing circuitry is located on the frame and electrically interconnected with the thermopiles.