Abstract: Certain exemplary embodiments can provide structures used to form printed board layer-to-layer interconnects using solder. When the structures are laminated together, forming a printed board, the solders fuse or bond to other electrically conductive materials forming layer-to-layer interconnects. Benefits include reduced fabrication time and costs, fewer and simpler process steps, known metallurgy, increased reliability, and a significant reduction in environmental impact.

Abstract: A method for enabling multiple subscriber identification module (SIM) profiles on a single embedded SIM includes installing a first SIM profile associated with a first mobile communication service that a user subscribes to and installing a second SIM profile associated with a second mobile communication service that the user subscribes to that is different than the first mobile communication service. The method also includes simultaneously enabling the first SIM profile to communicate with data processing hardware via a dedicated first communication interface and the second SIM profile to communicate with the data processing hardware via a dedicated second communication interface. The method also includes when using the enabled first SIM profile and the enabled second SIM profile, connecting to the first mobile communication service and the second mobile communication service simultaneously.