Abstract: Apparatus for testing integrated circuit packages has a test circuit, a socket for receiving a standard circuit representing the packages being tested, and a special contact assembly for coupling to the packages being tested. Two sets of contacts in the assembly are permanently connected to the socket and the test circuit respectively, and one set is movable to connect with the other set or to terminals of a package being tested. A handler inserts the packages one at a time into the contact assembly and moves the movable set of contacts into circuit engagement with the package, and then the package is tested by the test circuit. The handler removes the package from the contact assembly and allows the movable set of contacts to engage the other set so that the standard circuit can be tested to verify that the test circuit is functioning correctly.