Abstract: An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.

Abstract: A biofeedback electronic stimulation device includes a processor for generating a first control signal and a plurality of second control signals responsive to at least one input signal. Transformer circuitry generates a stimulation signal including packets of at least one pulse responsive to the first control signal. Pulse circuitry configures the at least one pulse in the packet to a selected one of a plurality of configurations responsive to the plurality of second control signals. Output electrodes apply the at least one pulse in the packet to a user and detector circuitry detects zero crossings of the at least one pulse in the packet. The processor further causes generation of an indicator responsive to the detected zero crossings.

Abstract: A biofeedback electronic stimulation device includes a processor for generating a first control signal and a plurality of second control signals responsive to at least one input signal. Transformer circuitry generates a stimulation signal including packets of at least one pulse responsive to the first control signal. Pulse circuitry configures the at least one pulse in the packet to a selected one of a plurality of configurations responsive to the plurality of second control signals. Output electrodes apply the at least one pulse in the packet to a user and detector circuitry detects zero crossings of the at least one pulse in the packet. The processor further causes generation of an indicator responsive to the detected zero crossings.

Abstract: An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

Abstract: An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

Abstract: A packaging system, hereinafter referred to as the Critical Packaging System, relates to critical issues that associate with sensitive articles such as IC wafers before, during and after shipment phases. The system employs a choice of two or more specialty designed containers, and any one selected design having choices of two or more methods by which to avoid, reduce and/or eliminate wafer damage from breakage, scratches and/or corrosion during shipment phases. For the purpose of maximizing product yield during packaging phases a special apparatus is used to insert wafers within containers without scratch damage. The following programs are used in packaging: (1) Quality Assurance/Certification, (2) Critical Factor Monitoring, and (3) a Recycle and Refurbish Program. These programs are specifically designed to achieve new levels of product yields, reduce product cost, and landfill impact.

Abstract: Novel arrangements are disclosed that provide for replacement of printed circuit boards useful in regulating current for LEDs. In one embodiment, a conductive track is disclosed that forms a pattern for placement of electrical components. The track can be made out of any suitably conductive material and may be stamped, cut, or formed depending on the material type. The conductive track can conduct both electricity and heat. Portions of the conductive track can be removed creating a gap. Electrical components can be placed along the conductive track spanning the gap to create a circuit path. Other embodiments include wiring harnesses that contain embedded electrical components. The harnesses may occupy less space than some embodiments of the conductive track. An electrical connector may be provided to allow easy replacement of the LED.

Abstract: A pharmaceutical composition comprising (i) a first specific binding agent selected from an antibody or a large binding fragment of an antibody which specifically binds a target toxin, and (ii) a second specific binding agent which comprises a small binding fragment of an antibody which binds said toxin. The compositions are used in the treatment of toxin poisoning, for example following exposure to toxins such as Botulinum toxins.

Abstract: An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

Abstract: The security system provides an aircraft security system capable of protecting both single and multiple engine aircraft. Variations of the present system prevent unauthorized starting of protected aircraft and activate an alarm when engine starting it is attempted. Embodiments of the system draw no power from the aircraft when the security system is armed and in no way interferes with the normal starting or operation of the aircraft when the system is disarmed. Embodiments of the present system can activate an alarm when an aircraft's doors or panels are opened. Embodiments of the present invention can activate an alarm when installed equipment or other devices are tampered with or removed from their housings.

Abstract: An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.

Abstract: A packaging system, hereinafter referred to as the Critical Packaging System, relates to critical issues that associate with sensitive articles such as IC wafers before, during and after shipment phases. The system employs a choice of two or more specialty designed containers, and any one selected design having choices of two or more methods by which to avoid, reduce and/or eliminate wafer damage from breakage, scratches and/or corrosion during shipment phases. For the purpose of maximizing product yield during packaging phases a special apparatus is used to insert wafers within containers without scratch damage. The following programs are used in packaging: (1) Quality Assurance/Certification, (2) Critical Factor Monitoring, and (3) a Recycle and Refurbish Program. These programs are specifically designed to achieve new levels of product yields, reduce product cost, and landfill impact.

Abstract: A container for integrated circuit wafers provides protection for the wafers from mechanical shock and electrical charges. The wafers are mechanically protected by top and bottom cushions and side cushions. The top and bottom cushions each have foam within a membrane or film enclosure. The enclosure has openings so as to allow gas to pass in and out. The side cushions have resilient projections that protect the edges of the wafers. The side cushions are interposed between flanges of the top and bottom cushions. The individual wafers are separated from each other by leaf separators made of film. The film for the separators and the top and bottom cushions can be the same type. The film has a first layer made of a polymer with dissipative material therein and a second layer made of a polymer without the dissipative material. The first and second layers are coupled together. The insulating layer is placed into contact with a circuit side of the wafer. The dissipative material can be carbon.

Abstract: An integrated outdoor radio and directional antenna system provides a direct RF connection(s) on the signal path between a directional antenna and radio components to remove the lossy RF cable(s). Direct connections between the various components of the integrated radio and directional antenna system enable reduced cost and ease of manufacture. In certain embodiments, the integrated directional antenna and radio system provides a direct RF connection between the directional antenna and the radio, and a printed wiring board (PWB) -mounted connector provides a direct digital connection between the radio board(s) and a medium access control (MAC) board. An input/output (I/O) interface provides a digital network interface between the MAC unit and indoor processing circuitry. The digital network interface enables packets of digital information to pass between the indoor processing circuitry and the integrated directional antenna and radio system.